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Communication equipment chassis

A technology of communication equipment and chassis, which is applied in the direction of electrical equipment casing/cabinet/drawer, cooling/ventilation/heating transformation, electrical components, etc. Small and other problems, to achieve the effect of excellent heat dissipation, good waterproof performance, and enhanced ventilation and heat dissipation

Active Publication Date: 2012-09-05
ALLWIN TELECOMM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this kind of profile radiator still has a small total heat dissipation area in a limited space, and the profile thermal resistance is large, which makes it difficult to meet the heat dissipation requirements of high-power modules.

Method used

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  • Communication equipment chassis
  • Communication equipment chassis
  • Communication equipment chassis

Examples

Experimental program
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Embodiment Construction

[0024] refer to Figure 1 to Figure 5 , a communication equipment chassis, comprising a chassis body 3 and a radiator 4, the radiator 4 comprising: a bottom plate 1, which is used as a back sealing plate of the chassis body 3; a heat dissipation module 2, which is connected to the back of the bottom plate 1 , and it includes several heat dissipation modules 21, and the heat dissipation module 21 includes several heat dissipation pipes 211 connected to the back of the bottom plate 1 and several heat dissipation fins 212 connected by the heat dissipation pipes 211. The chassis body 3 includes a chassis door, a chassis frame and a base. The chassis frame is made of aluminum alloy plates bent and fully welded, and the appearance is painted. There is a waterproof adhesive strip between the chassis door and the chassis frame. It is fixed with the chassis frame with screws, and the surface treatment is the same as that of the chassis frame.

[0025] As a further preferred embodiment...

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Abstract

The invention discloses a communication equipment chassis. The communication equipment chassis comprises a chassis body and a radiator, wherein the radiator comprises a base plate and a radiating module set; the base plate serves as a back sealing plate of the chassis body; the radiating module set is connected with the back of the base plate and comprises a plurality of radiating modules; each radiating module comprises a plurality of radiating tubes and a plurality of radiating fins; the plurality of the radiating tubes are connected with the back of the base plate; and the plurality of theradiating fins are connected by the radiating tubes. In the communication equipment chassis, a section bar radiator in the conventional equipment chassis is changed into the plurality of the radiating modules which comprise the radiating tubes and the radiating fins; the radiating modules form the radiating module set; the radiating fins are connected by the radiating tubes, so a radiating area is greatly increased compared with the section bar radiator on the premise of the same space volume by increasing the numbers of the radiating fins and the radiating tubes; an overall radiating area isfurther increased by increasing the number of the radiating modules; the radiating efficiency is increased; and the radiating equipment on the communication equipment chassis is met.

Description

technical field [0001] The invention relates to a cabinet, in particular to a communication device cabinet. Background technique [0002] The communication equipment chassis is used to accommodate and install communication equipment. Since the circuit modules of communication equipment generate a large amount of heat, it is necessary to equip the airtight chassis with a radiator for heat dissipation. The general communication equipment chassis includes a chassis body and a heat sink. device in two parts. The current radiator generally adopts a profile radiator. The main body of the profile radiator is an aluminum profile with a long strip of cooling fins pulled out through a stretching and pressing die. After the profile is formed, it is welded to the back of the chassis as a radiator to form an integral body. Rely on the surface of the heat sink to increase the heat dissipation area. However, in a limited space, this profile radiator still has a small total heat dissipati...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00H05K7/20
Inventor 潘世胆郝禄国杨建坡
Owner ALLWIN TELECOMM
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