Apparatus and method for mounting component
A technology of parts installation and parts, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of substrates that cannot be used for mounting parts, consume substrate movement, positioning time, hinder the production cycle of parts, etc., and achieve low equipment cost The effect of high precision, high positional accuracy, and maintenance of flatness
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no. 1 approach
[0086] First, refer to Figure 1- Figure 13 A component mounting device according to a first embodiment of the present invention will be described.
[0087] exist Figure 1A , Figure 1B and figure 2 In this first embodiment, the substrate 1 to be mounted is, for example, formed into a flat plate shape by laminating two glass plates having a rectangular shape with a side length of several 100 mm to 2000 mm and a thickness of about 0.5 mm to 0.7 mm. In the substrate 1, the two edge portions 2a, 2b of the long side and the short side adjacent to each other are the protruding parts of only one glass plate among the bonded glass plates, and one glass plate in the respective edge portions 2a, 2b The surface of the board is provided with a plurality of mounting areas 3 which are areas where parts are mounted. A plurality of connection electrode portions formed by arranging transparent electrodes, that is, a plurality of connection electrodes in parallel with fine gaps, are arra...
no. 2 approach
[0111] Next, refer to Figures 14 to 17 A component mounting device according to a second embodiment of the present invention will be described. In addition, in the following description of this second embodiment, the same reference numerals are assigned to the same constituent elements as those of the above-mentioned embodiment, and description thereof will be omitted, and differences will be mainly described.
[0112] The component mounting device of the second embodiment differs from the above-mentioned first embodiment only in the structure of the final crimping devices 14 and 15, and the structures of the final crimping device 14 and the final crimping device 15 are also basically the same as described above. Therefore, the final crimping device 15 that performs the final crimping of the two components 5 temporarily crimped to the edge portion 2b on the short side of the substrate 1 will be described by taking the two final crimping devices 14 and 15 as a representative. ...
no. 3 approach
[0118] Next, refer to Figure 18A and Figure 18B A component mounting device according to a third embodiment of the present invention will be described.
[0119] Such as Figure 18A and Figure 18B As shown, in the parts mounting device 10 of the third embodiment, the conveying device 11 and the working devices 12 to 15 ( Figure 18A and Figure 18B In , the partition device 60 that partitions between the main crimping devices 14) is exemplified. Such as Figure 18A As shown, in the partition device 60, the gate components 61a, 61b that can be separately lifted and lowered into two parts are overlapped and arranged on the lower part of the side end of the conveying device 11 side of the operating devices 12-15. During maintenance, such as Figure 18B As shown, the shutter members 61a and 61b are raised to the blocking position, whereby the transport device 11 and the working devices 12 to 15 can be blocked.
[0120] In a component mounting device that conveys a substr...
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Abstract
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