High-power light-emitting diode (LED) package structure

Abstract

The invention discloses a high-power light-emitting diode (LED) package and heat sink structure, comprising an LED chip, a crystal sealing face and an LED thermal sedimentation main support. The LED package structure is characterized in that the lower end of the high-power LED thermal sedimentation main support is provided with a prolongation part, the prolongation part and the original thermal sedimentation main support can be an integrally molded cylindrical object; and taping and thread chaing are carried out on the prolongation part to form a fastening thread. A high-power LED package is installed on a thermal radiator by a threaded connection mode, thereby greatly simplifying the installation technology of the high-power LED package, improving light flux, effectively reducing light decline level, increasing stable lightening property, largely reducing defective goods rate at later stage and prolonging the service life of light source equipment.

Description

【Technical field】 [0001] The invention relates to the field of packaging of light source LEDs for lighting equipment, in particular to a structure for installing high-power LED packages at room temperature. 【Background technique】 [0002] As we all know, the so-called LED refers to light-emitting diodes. As a new type of light source that is widely used and developed rapidly, compared with traditional light sources, LED has energy saving, high efficiency, small size, long life, fast response, low driving voltage, and excellent shock resistance. And other advantages, so that it can rapidly develop and expand the industry scale and market share. Under the guidance of industry trends, its technology is constantly updating and deepening. However, the biggest technical barrier restricting the development of LED light sources is the heat conduction and heat sinking of LED packaging. Problems, poor packaging technology and fixed installation scheme will damage the stable lighting a...

AI Technical Summary

Problems solved by technology

These two methods have their own disadvantages: the first method requires the use of thermally conductive adhesives with high thermal conductivity, which will increase the cost and technical requirements accordingly. In addition, after a period of use, the thermal conductivity of thermally conductive adhesives will decrease. Most of the heat conduction effect; and the second way, the heat sinking main bracket and the material of the heat dissipation device are required to be weldable

The most important thing is that these two methods will be exposed to high temperature between the LED chip and the heat sink, which will easily damage the LED chip, resulting in a decrease in luminous flux, damage to the LED package structure, changes in electrical parameters, and light generation. decline

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