Packaging structure of resin circuit board and chip for squarely installing heat radiating block with locking hole

Abstract

The invention relates to a packaging structure of a resin circuit board and a chip for squarely installing a heat radiating block with a locking hole, comprising a chip (3), a single-layer or multilayer resin circuit board (9), a metal wire (5), a conductive or nonconductive heat-conducting bonding material I (2) and a plastic package body (8), wherein the single-layer or multilayer resin circuit board (9) is loaded below the chip, the metal wire (5) is used for interlinking signals of the chip to the single-layer or multilayer resin circuit board, and the heat-conducting bonding material I (2) is arranged between the chip and the single-layer or multilayer resin circuit board (9). The packaging structure is characterized in that a heat radiating block (7) is arranged above the chip (3) and is provided with a locking hole (7.1), and a conductive or nonconductive heat-conducting bonding material II (6) is inlaid between the heat radiating block (7) and the chip (3). The packaging structure has the high-heat radiating function by the fact that the heat radiating block is additionally arranged above the chip, has the capability for heat radiating, ensures that the heat of the chip can be rapidly conducted to the outside of the package body, and avoids rapid ageing of and even burn or burnout of the chip.

Description

(1) Technical field [0001] The invention relates to a resin circuit board chip front mounting structure with a cooling block with locking holes. It belongs to the technical field of semiconductor packaging. (2) Background technology [0002] The traditional heat dissipation method of chip packaging mainly uses the metal base island under the chip as a heat dissipation tool or way, and the heat dissipation conduction of this traditional packaging method has the following shortcomings: [0003] 1. The metal base island is too small [0004] In the traditional packaging form, in order to pursue the reliability and safety of the package, almost all metal-based islands are embedded in the package, and in the limited package, the metal-based island and signal and power conduction must be embedded at the same time. Metal inner feet used (such as figure 1 and figure 2 As shown), the effective area and volume of the metal-based island are very small, and at the same time, the me...

AI Technical Summary

Problems solved by technology

[0008] Although the metal-based island is exposed, it can provide better heat dissipation than the embedded type, but because the volume and area of ​​the metal-based island are still very small in the package, the ability to provide heat dissipation is still very limited.

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