A printed circuit board having a bump and a method of manufacturing the same
A technology of printed circuit boards and manufacturing methods, applied in the direction of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as weak connection strength, bending, and easy breakage
Inactive Publication Date: 2011-04-06
SAMSUNG ELECTRO MECHANICS CO LTD
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Problems solved by technology
[0015] However, in the case of the printed circuit board according to the prior art, in order to form solder balls, a process of forming an opening in the solder resist layer 2 to expose the pad unit 3 to the outside and a process of printing and reflowing solder paste must be performed, by This will increase the manufacturing process and manufacturing cost
[0016] In addition, the solder ball 1 is only supported by the pad unit 3, so the bonding strength between the solder ball 1 and the printed circuit board is weak, causing the solder ball 1 to be easily broken or torn due to an external force (eg, shearing force, etc.). The problem of bending in the direction of shear force
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[0052] Various objects, advantages, and features of the present invention will be clearly understood from the following description of the embodiments with reference to the accompanying drawings.
[0053] The terms and phrases used in this specification and claims should not be construed as being limited to the usual meanings or dictionary definitions, but based on the inventor's ability to properly define the term concepts to best describe what he knows for implementing the present invention. The rule of best method, the terms and phrases should be understood as having meanings and concepts related to the technical scope of the present invention.
[0054] The above and other objects, features and advantages of the present invention will be more clearly understood from the following more detailed description taken in conjunction with the accompanying drawings. In the specification, adding reference numerals to the drawings, it is understood that the same reference numerals may...
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Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board.
Description
[0001] Cross References to Related Applications [0002] This application claims Korean Patent Application No. 10-2010-0072923, filed Jul. 28, 2010, entitled "A Printed Circuit Board Having A Bump And A Method Of Manufacturing The Same," filed Aug. 31, 2009 Korean Patent Application No. 10-2009-0081179 entitled "A Printed Circuit Board Comprising A Bump And A Method Of Manufacturing The Same", the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a printed circuit board with bumps and a manufacturing method thereof. Background technique [0004] At present, electronic products have more and more functions and faster and faster speeds. In response to this trend, the development speed of semiconductor chips and printed circuit boards mounted with the semiconductor chips and connecting the semiconductor chips to a main board is also increasing. [0005] The development of printed circuit boards mounted wit...
Claims
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IPC IPC(8): H05K1/11H05K1/02H05K3/40
CPCH05K2203/0338H05K3/007H05K3/4015H05K3/4007H05K3/20H05K3/28H05K2201/0367H05K2201/10242Y10T29/49155
Inventor 曹硕铉安镇庸郑淳五田东柱金起焕金昞文
Owner SAMSUNG ELECTRO MECHANICS CO LTD