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Electronic equipment assembly and correlation method

A technology for electronic equipment and components, applied in the field of electronic equipment components, can solve problems such as affecting the aesthetic appearance of equipment

Active Publication Date: 2011-04-06
APPLE INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As yet another example, excess material can adversely affect the aesthetic appearance of the device

Method used

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  • Electronic equipment assembly and correlation method
  • Electronic equipment assembly and correlation method
  • Electronic equipment assembly and correlation method

Examples

Experimental program
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Embodiment Construction

[0024] An electronic device may include several components that fit together to form the internal and external characteristics of the device. For example, one or more internal components (eg, electronic circuits) may be placed within external components (eg, housings) to provide a device with the required functionality. The various assemblies can be manufactured using several methods including, for example, assembling and connecting the various elements together. In some cases, the outer housing assembly can be constructed by assembling several elements together to form a unitary assembly.

[0025] figure 1 is a schematic diagram of an illustrative peripheral component constructed by joining together several elements according to one embodiment of the invention. The peripheral member 100 may be configured to form an outer surface of an electronic device. In particular, peripheral member 100 may surround or surround some or all of the electronic components such that periphe...

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PUM

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Abstract

The invention relates to an electronic equipment assembly and a correlation method, capable of providing the decorative ornaments on the assembly for connecting a plurality of elements. Such as a mechanical processing or grinding single manufacture technology can be used in the connected element and some or all material from the elements is removed to form a smooth continuous surface of an interface spanning each element of the assembly. In some cases, the setting of the material removing process can be adjusted based on the material of the assembly element. For example, the setting can be adjusted based on the manufacture or mechanical feature of each kind of the element material.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of the following patent applications: U.S. Provisional Patent Application No. 61 / 300,780, filed February 2, 2010; U.S. Provisional Patent Application No. 61 / 325,625, filed April 19, 2010; and US Provisional Patent Application No. 61 / 325,786, filed on the 19th, all of which are hereby incorporated by reference in their entirety. [0003] The invention disclosed and claimed in this application was released to the public prematurely and without Apple's authorization when a prototype of Apple's iPhone 4 was apparently stolen from Apple engineers on March 25, 2010. At least one of the US priority applications on which this application is based had not been filed prior to it being apparent that it was stolen. technical field [0004] The present invention relates to an electronic device component and related method. Background technique [0005] Portable electronic devices can be constr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/00
CPCG06F1/1626G06F1/1656
Inventor S·梅尔斯R·赫勒M·西奥博尔德A·斯塔纳罗谭堂R·迪纳D·帕库拉
Owner APPLE INC
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