Chemical nickel-phosphorus alloy plating solution capable of obtaining high-solderability plating layer

Abstract

The invention relates to a chemical nickel-phosphorus alloy plating solution capable of obtaining a high-solderability plating layer. The solution comprises nickel sulfate, sodium hypophosphite, a complexing agent containing carboxylate radicals, bivalent tin ions and dimercaptosuccinic acid or dimercaptosuccinate, wherein, the complexing agent containing the carboxylate radicals is selected fromone or combination of a plurality of glycollic acid, lactic acid, malonic acid, succinic acid, malic acid, tartaric acid, citric acid, gluconic acid, acetic acid, propionic acid, aminoacetic acid or corresponding salts of various acids; and the pH value of the solution is adjusted to 4-7. By adopting the chemical nickel-phosphorus alloy plating solution capable of obtaining the high-solderabilityplating layer, the chemical nickel-phosphorus plating layer achieves better solderability and is not restricted by the phosphorus content in the plating layer, thus solving the solderability problem of the chemical nickel-phosphorus plating layer and lowering the cost.

Description

technical field [0001] The invention belongs to the field of electroless nickel plating, in particular to an electroless nickel-phosphorus alloy solution capable of obtaining a highly weldable coating. Background technique [0002] The electroless nickel-phosphorus coating has good anti-corrosion performance, high hardness and good brightness. At the same time, the electroless nickel plating process has excellent throwing performance and has self-catalytic characteristics without electricity. Electroless nickel-phosphorus coatings are widely used in chemical, textile, mold, gear and other mechanical industries, and also widely used in the electronic industry such as PBC, hard disks, electronic component substrates, heat sinks and other products for surface treatment. [0003] Electroless nickel-phosphorus plating as the surface material of the plated parts usually involves welding problems, which is especially prominent in the application of the electronics industry. There ...

AI Technical Summary

Problems solved by technology

Although the solderability of the low-phosphorus electroless nickel-phosphorus coating is good, there are also defects: the plating solution starts from the tank, and as the use time continues, the phosphorus content in the coating will gradually increase, and the solderability will gradually deteriorate.

Although this method of replacing gold and palladium can improve the solderability of the coating, it also greatly increases the production cost.