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Electrical test adapter plate of sealing base plate and method thereof

A technology for electrical testing and packaging substrates, which is applied in the field of electrical testing adapter boards, and can solve problems such as inapplicability, arrangement spacing that cannot correspond to narrowing pad spacing, and inability to smoothly contact the surface of the pads, etc.

Active Publication Date: 2011-04-13
ASE SHANGHAI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the contact points 122 of the adapter plate 12 are generally columnar or spherical and have a certain length and width, if the size of the contact points 122 cannot be further reduced, the arrangement distance of the contact points 122 cannot be further reduced. Correspondingly, it is reduced to match the pad pitch of the substrate used for the contact array package structure, and the end of the contact point 122 cannot smoothly contact the pad surface of this type of substrate.
As a result, the adapter board 12 specifications of the existing test equipment are not suitable for testing the substrate used for the contact array package structure, and this type of substrate encounters a technical bottleneck in testing

Method used

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  • Electrical test adapter plate of sealing base plate and method thereof
  • Electrical test adapter plate of sealing base plate and method thereof
  • Electrical test adapter plate of sealing base plate and method thereof

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Embodiment Construction

[0024] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and understandable, the preferred embodiments of the present invention will be specifically cited below, together with the accompanying drawings, for a detailed description as follows:

[0025] The present invention mainly provides an electrical test adapter board used in a testing device for packaged substrates, so as to be preferably used in testing substrates with small pitches between pads. The substrate with a small pad pitch in the present invention refers to a substrate with a pad pitch of less than 0.9 mm (millimeter), for example, it is preferably used for testing a land array (LGA) package substrate.

[0026] Please refer to figure 2 and 2A As shown, the package substrate testing device of the first embodiment of the present invention includes a probe card 21 and an adapter board 22 for detecting whether a substrate 23 has an open / short defect. The p...

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Abstract

The invention discloses an electrical test adapter plate of a sealing base plate and a method thereof. Adapting pads with proper size for being used as convex pad-shaped contact points are directly formed on the surface of the adapter plate; the convex pad-shaped contact points have size design, such as smaller arrangement distance, proper convex height, and the like so that the convex pad-shapedcontact points can smoothly get in contact with the adapting pad in an opening of a welding prevention layer of a base plate; and the adapter plate is particularly suitable for detecting the base plate with tiny adapting pad distance. Accordingly, the adapter plate of the invention has test limit improving effect and expanded application range.

Description

【Technical field】 [0001] The present invention relates to an electrical test adapter board for a packaging substrate and a method thereof, in particular to an electrical test adapter board for detecting a contact array (LGA) type packaging substrate by using bump-like contact points and the method thereof. its method. 【Background technique】 [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging structures, among which the common packaging structures with substrates include ball grid array packaging structures (ball grid array, BGA), Pin array package structure (pin grid array, PGA), contact array package structure (land grid array, LGA) or substrate chip package structure (board onchip, BOC), etc. In the ball grid array packaging structure (BGA), the substrate used must first pass the electrical test program to detect the open circuit / short circuit (open / short) ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/02
Inventor 尹鹏跃杨红涛赵欢欧宪勋颜怡锋罗光淋
Owner ASE SHANGHAI
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