Process for manufacturing whole gold-plated board

A production process and gold-plated area technology, which is applied to the production process of full-plate gold-plated plates, can solve the problems of gold-plated area collapse, poor gold-plated quality, and unclean etching, and achieve the effect of reduced total cost, low cost, and flexible production arrangement.

Inactive Publication Date: 2012-05-09
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The main technical problem to be solved by the present invention is to provide a manufacturing process for a full-plate gold-plated plate, which can overcome the defects of gold-plated permeation, unclean etching, poor quality of gold-plated and collapse of gold-plated areas

Method used

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  • Process for manufacturing whole gold-plated board
  • Process for manufacturing whole gold-plated board
  • Process for manufacturing whole gold-plated board

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Embodiment Construction

[0033] In order to describe the technical content, structural features, achieved goals and effects of the present invention in detail, the following will be described in detail in conjunction with the embodiments and accompanying drawings.

[0034] see Figure 1 to Figure 7 , as an embodiment of the manufacturing process of the full plate gold-plated plate of the present invention, comprises the following steps:

[0035] a. On the circuit board, make all in-board graphics and conductive auxiliary sides 3 with gold-plated area 1 and gold-plated auxiliary area 2 at one time, and the conductive auxiliary side 3 is not connected with the in-board graphics in this step, so The gold-plated auxiliary area 2 is electrically connected to the gold-plated area 1, such as figure 1 shown;

[0036] b. screen printing conductive ink 4 on the gold-plated auxiliary area 2, the conductive ink 4 covers all gold-plated auxiliary areas 2, and electrically connects between all gold-plated areas 1...

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PUM

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Abstract

The invention discloses a process for manufacturing a whole gold-plated board. The process comprises the following steps: a. making all the patterns in the board and a conductive auxiliary frame on the circuit board once; b. screen-printing conductive printing ink on auxiliary gold-plated areas; c. covering the conductive printing ink layer with a protective dry film; d. adopting the conductive printing ink as the gold-plated leads to plate gold on gold-plated areas on the circuit board; e. removing the protective dry film; f. removing the conductive printing ink layer; and g. carrying out solder resist on the auxiliary gold-plated areas and the conductive auxiliary frame, wherein the patterns in the board are provided with the gold-plated areas and the auxiliary gold-plated areas; and the conductive printing ink ensures all the gold-plated areas to be electrically connected with each other and with the conductive auxiliary frame. Through the process, the problems of seepage plating, incomplete etching and collapse of the gold-plated surfaces are solved, and the production cycle is short and the efficiency is quite obviously improved as about 10min is only needed to print the conductive printing ink and remove the conductive printing ink.

Description

technical field [0001] The invention relates to a manufacturing process of a full-plate gold-plated plate. Background technique [0002] The existing full-board gold-plated board manufacturing process adopts the gold-plated process before graphics, and its technological process is as follows: blanking-inner layer processing-lamination-drilling-copper sinking-electroplating-outer layer graphics (use a large copper surface as a gold-plated wire , develop the gold-plated area for gold-plating)-full board gold-plating-external alkali etching (remove all dry film, etch non-gold-plated area)-external inspection-solder mask-character-surface coating-shape-electrical test-cheng inspection- Package. [0003] However, the pre-patterning process has the following drawbacks: [0004] a. It is easy to be gold-plated, permeated, and etched clean: use a large copper surface as a gold-plated wire, and use a dry film to cover the non-gold-plated area. Because there are certain problems in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/18H05K3/24
Inventor 刘宝林王成勇武凤伍罗斌崔荣
Owner SHENNAN CIRCUITS
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