Laser machining tool having expanded work space

A technology of laser processing machine and laser processing head, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effect of reducing space requirements and high synchronization

Active Publication Date: 2014-07-30
TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Only workpieces that are much smaller than the base of the laser processing machine can be processed with the described known configuration of the laser processing machine

Method used

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  • Laser machining tool having expanded work space
  • Laser machining tool having expanded work space
  • Laser machining tool having expanded work space

Examples

Experimental program
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Effect test

Embodiment Construction

[0035] figure 1 A laser processing machine 10 is shown with a workpiece holder 11 on which a workpiece 12 is arranged. A support structure 13 in the form of a gantry is arranged above the workpiece 12 . The support structure 13 is movable along the guides 15 , 16 in the direction of the double arrow 14 . Here, the carrier structure 13 is driven by a linear drive. The device causing the movement in the direction of the double arrow 14 is called the (tool) shaft. Laser processing heads 17 , 18 are arranged on both sides of the carrier structure 13 . The laser machining head is movable relative to the carrier structure 13 in the direction of the double arrow 19 . The device which brings about the movement in the direction of the double arrow 19 is likewise called the (tool) shaft. Since the laser processing heads 17 , 18 are arranged on both sides of the carrier structure, a maximum working area is achieved. In particular, workpieces can be machined which essentially have t...

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PUM

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Abstract

The invention relates to a laser processing machine (10) having a carrier structure (13) and a workpiece holder and / or workpiece holder (11), on at least one side of which carrier structure at least one laser processing head (17) is arranged , 18), wherein the laser processing head (17, 18) and the workpiece holding device and / or the workpiece support (11) can move relative to each other, on two opposite sides of the carrier structure (13) At least one laser processing head (17, 18) is provided and a beam switch is provided, by means of which the laser beam can be switched between the laser processing heads. This increases the working area.

Description

technical field [0001] The invention relates to a laser processing machine with a carrier structure and a workpiece holding device and / or a workpiece support, at least one laser processing head is arranged on one side of the carrier structure, wherein the laser processing head and the workpiece holding device And / or the workpiece holders are movable relative to each other. Background technique [0002] A laser processing machine is known, for example, from JP 03-138092A, in which the workpiece to be processed is placed on a workpiece holder. A gantry may be arranged above the workpiece support in the longitudinal direction of the workpiece. A laser processing head can be arranged on one side of the gantry, which can be moved relative to the workpiece by the movement of the gantry. Workpieces can be processed with the aid of the laser processing head. Only workpieces that are much smaller than the base of the laser processing machine can be processed with the described kno...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/06B23K26/08B23K26/067B23K26/10
CPCB23K26/10B23K26/0869B23K26/083B23K26/0604B23K26/067B23K26/0673
Inventor A·克特纳-赖希
Owner TRUMPF WERKZEUGMASCHINEN GMBH & CO KG
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