Direct interface method of USB 3.0 bus and high speed intelligent unified bus

A bus, high-speed technology, applied in the field of direct interface between USB3.0 bus and high-speed intelligent unified bus, can solve the problems of signal-to-noise ratio weakening, deteriorating information sharing, weakening the advantage of USB3.0 transmission speed, etc., to avoid bus Conflict, avoid data loss, achieve the effect of interconnection

Inactive Publication Date: 2012-05-30
NORTHWESTERN POLYTECHNICAL UNIV
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the USB protocol, USB3.0 devices can be backward compatible with USB1.0, USB1.1 and USB2.0 standards, although the data stream of the USB3.0 protocol can be converted into the USB2.0 standard, and then communicate with other devices through the USB2.0 bus The interface in the form of a bus can indirectly realize the conversion of the USB3.0 interface, but the advantage of the USB3.0 transmission speed will be greatly weakened, and the increase in the number of data turnover will definitely reduce the reliability and integrity of the transmission; Will lead to the weakening of the signal-to-noise ratio of the signal, deteriorating the sharing of information

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Direct interface method of USB 3.0 bus and high speed intelligent unified bus
  • Direct interface method of USB 3.0 bus and high speed intelligent unified bus
  • Direct interface method of USB 3.0 bus and high speed intelligent unified bus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] refer to Figure 1~6 , to describe the present invention in detail.

[0021] The invention is an interface method between a USB3.0 bus and an intelligent bus, which realizes the high-speed optical fiber transmission of the USB3.0 device through the high-speed intelligent bus and the data reception of high-speed optical fiber data based on the USB3.0 bus. The hardware structure of the invention includes a USB3.0 bus controller, an intelligent bus controller, a central bus arbitration controller and a high-speed mass memory.

[0022] In this embodiment, the scheduling and interface control of the two buses are mainly completed in the high-speed logic array FPGA, and the FPGA adopts the EP1C12 chip of the Cyclone series of Altera Corporation of the United States. The chip has a density of 12060 LE units, which can fully meet the needs of image processing algorithms and system logic control; 169 user-available I / O ports meet the system's multi-chip connection requirements ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a direct interface method of a USB (universal serial bus) 3.0 bus and a high speed intelligent unified bus which is used for solving the technical problem of low interconnection speed between the existing USB 3.0 bus and other buses. The technical scheme comprises the following steps: analyzing the standard of USB 3.0 through designing a USB 3.0 controller, receiving the effective data on the USB 3.0 bus correctly and completely, and receiving and transmitting the intelligent bus data at a high speed by utilizing a fiber channel through the high-speed transceiver SerDes; using a high-speed buffer storage to realize buffer storage of bidirectional data; and using a clock control module to realize clock exchange of buses with different speeds, thus high-speed reliable and effective transmission of two kinds of bus data is realized.

Description

technical field [0001] The invention relates to a bus interface method, in particular to a direct interface method between a USB3.0 bus and a high-speed intelligent unified bus. Background technique [0002] After the USB interface technology has gone through USB1.0, USB1.1, and USB2.0, in 2008, the USB3.0 organization released the USB3.0 official standard white paper. On the basis of the previous versions, USB3.0 version has proposed more advanced standards and wider application fields. The goal of USB3.0 technology is to use the same architecture design as the existing USB to achieve a transmission speed that is more than 10 times faster than the current USB2.0 interface (its transmission rate can reach 5Gbps), and it also has the ease of use of traditional USB technology and plug-and-play functionality. The new standard optimizes the USB3.0 specification to achieve lower energy consumption and higher protocol efficiency, and supports both copper and optical fiber cables...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): G06F13/38
Inventor 史忠科王闯贺莹
Owner NORTHWESTERN POLYTECHNICAL UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap