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Method of manufacturing semiconductor device and mask

A semiconductor and device technology, which is applied in the field of manufacturing semiconductor devices and masks, can solve problems such as bump pitch narrowing, and achieve the effects of bump pitch narrowing, productivity improvement, and yield improvement

Inactive Publication Date: 2011-04-20
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the resin used to form the bump core is stretched, and thus there may conversely be a case where it is difficult to narrow the bump pitch

Method used

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  • Method of manufacturing semiconductor device and mask
  • Method of manufacturing semiconductor device and mask
  • Method of manufacturing semiconductor device and mask

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Embodiment Construction

[0029] Herein, the invention will now be described with reference to exemplary embodiments. Those skilled in the art will recognize that many alternative embodiments can be accomplished using the teachings of the present invention and that the invention is not limited to the embodiments illustrated for explanatory purposed.

[0030] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. Throughout the drawings, similar elements are denoted by like reference numerals, and descriptions thereof will not be repeated.

[0031] Figure 1A and Figure 1B to Figure 3A and Figure 3B is to show the method of manufacturing the semiconductor device according to the first embodiment. A method of manufacturing a semiconductor device includes the following procedures. First, a plurality of electrode pads 130 are formed on the substrate 100 . Next, the protective insulating film 120 is formed at the plurality of electrode pads 13...

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Abstract

A photosensitive resin film is formed on a protective insulating film. Next, a plurality of bump cores is formed on the protective insulating film along a first straight line by exposing and developing the photosensitive resin film. Next, a plurality of bumps, and a plurality of interconnects that connects each of the plurality of bumps to any of the electrode pads are formed by selectively forming conductive films on a plurality of bump cores, a plurality of electrode pads, and the protective insulating film. In the step of forming a plurality of bump cores, a region bordering on the interconnect on the lateral faces of the bump core is formed to have a gentler slope than that of a region intersecting the first straight line, by exposing the photosensitive resin film only one time using a multi-gradation mask.

Description

[0001] This patent application is based on Japanese Patent Application No. 2009-209640, the contents of which are incorporated herein by reference. technical field [0002] The present invention relates to a method and mask for manufacturing a semiconductor device with bumps, in which a conductive film is formed on a bump core made of resin. Background technique [0003] Bumps are formed in semiconductor devices in order to mount the semiconductor devices on mounting boards. A circuit with a semiconductor device is connected to an electrode such as a land of a mounting board through the bump. In recent years, a technique has been developed in which the core of the bump is formed of resin, and the bump is formed by forming a conductive film on the core. In this technique, in order to narrow the bump pitch and maintain the coatability of the conductive film relative to the bump core, it is preferable to make the side of the bump core facing the electrode pad side smaller than...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/32H01L21/3205H01L21/60H01L21/768H01L23/12H01L23/522
CPCH01L2924/01005H01L24/13H01L2924/01082H01L2924/01033H01L2924/01006H01L24/14H01L2224/13099H01L2924/01079G03F1/144H01L2224/024H01L2924/3025H01L2224/0236H01L2224/0401H01L2924/15788G03F1/50H01L2224/1411H01L2224/13008H01L2924/00
Inventor 别宫史浩
Owner RENESAS ELECTRONICS CORP
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