Small-divergence-angle solid laser pumping module encapsulating structure
A solid-state laser, module packaging technology, applied in semiconductor laser devices, laser devices, semiconductor lasers, etc., can solve the problem of high working current
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[0017] Such as Figure 1-5 As shown, a small divergence angle solid-state laser pump module packaging structure is composed of a laser array 1 composed of multiple independent semiconductor laser device monomers, a metallized ceramic heat sink 2 and a heat sink 3. In the laser array 1 The semiconductor laser device monomers are all welded on the ceramic heat sink, and the series connection and heat transfer contact are realized through the metallization structure on the surface of the ceramic heat sink 2. The bottom of the ceramic heat sink 2 is welded on the upper surface of the heat sink. The generated heat is dissipated to an external heat exchange system through the laser array 1 , the ceramic heat sink 2 and the heat sink 3 .
[0018] The semiconductor laser device monomer is welded together by a laser chip 1.1 and a substrate with a positive electrode 1.2 and a negative electrode 1.3. The positive and negative electrodes are separated by an electrical insulator 1.4, and ...
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