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Small-divergence-angle solid laser pumping module encapsulating structure

A solid-state laser, module packaging technology, applied in semiconductor laser devices, laser devices, semiconductor lasers, etc., can solve the problem of high working current

Active Publication Date: 2012-04-11
WUXI LUMISOURCE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the point of view of electrical connection, since the 1 cm bar is composed of multiple laser monomers connected in parallel, the working current is relatively high

Method used

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  • Small-divergence-angle solid laser pumping module encapsulating structure
  • Small-divergence-angle solid laser pumping module encapsulating structure
  • Small-divergence-angle solid laser pumping module encapsulating structure

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Embodiment Construction

[0017] Such as Figure 1-5 As shown, a small divergence angle solid-state laser pump module packaging structure is composed of a laser array 1 composed of multiple independent semiconductor laser device monomers, a metallized ceramic heat sink 2 and a heat sink 3. In the laser array 1 The semiconductor laser device monomers are all welded on the ceramic heat sink, and the series connection and heat transfer contact are realized through the metallization structure on the surface of the ceramic heat sink 2. The bottom of the ceramic heat sink 2 is welded on the upper surface of the heat sink. The generated heat is dissipated to an external heat exchange system through the laser array 1 , the ceramic heat sink 2 and the heat sink 3 .

[0018] The semiconductor laser device monomer is welded together by a laser chip 1.1 and a substrate with a positive electrode 1.2 and a negative electrode 1.3. The positive and negative electrodes are separated by an electrical insulator 1.4, and ...

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PUM

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Abstract

The invention relates to a small-divergence-angle solid laser pumping module encapsulating structure, which consists of a laser array, surface metallized ceramic heat radiation fins and heat sinks, wherein the laser array is formed by a plurality of independent semiconductor laser monomers, all of the semiconductor laser monomers in the laser array are welded on the ceramic heat radiation fins and are connected in series and in heat transfer contact through the metallized structures arranged on the surface of the ceramic heat radiation fins, and the bottoms of the ceramic heat radiation fins are welded on the upper surfaces of the heat sinks. In the small-divergence-angle solid laser pumping module encapsulating structure, on the basis that the slow axis of light beams output by the encapsulated pumping module is parallel to the axial line of crystals pumped by the pumping module, the divergence angle of the light beam array is converted from the fast axis limitation to the slow axis limitation, i.e. the divergence angle is reduced from the typical 40 degrees of an 808nm device to a value smaller than 10 degrees. Compared with the traditional bar encapsulating product in the market, the module of the design is formed by serially connecting a plurality of monotube lasers, therefore, the work current is greatly reduced, the requirement on the power supply and circuit current bearing capability of a pumping system is greatly reduced, and the use by customers is convenient.

Description

technical field [0001] The invention relates to the technical field of packaging of semiconductor laser devices. Background technique [0002] High-power and ultra-high-power solid-state laser systems are one of the strategic directions of national technology development. In recent years, the country has continuously increased investment. During the 12th Five-Year Plan period, the Ministry of Science and Technology clearly proposed to produce 3-5 kilowatt-class high-power solid-state lasers . This type of laser requires high-quality and stable performance semiconductor laser pump modules, and most of these modules currently rely on imports. [0003] The high-power semiconductor lasers used for side pumping on the market are all packaged in 1 cm bar. This package causes a large beam divergence angle. To improve the crystal pumping efficiency, the light-emitting surface of the pump module must be moved to a distance from the crystal. where the rod is tight, or where the ligh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01S5/40H01S5/024
Inventor 李大明潘华东张军
Owner WUXI LUMISOURCE TECH