Water-cooling heat sink
A technology of water cooling and heat dissipation, cold plate, applied in the direction of cooling/ventilation/heating transformation, instrument, electrical digital data processing, etc., can solve the problem of not being able to adapt to the increase of heating elements, and achieve the effect of reducing the internal temperature
Active Publication Date: 2012-10-31
SUZHOU INOVANCE TECH CO LTD
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Problems solved by technology
[0005] The technical problem to be solved by the present invention is to provide a water-cooling heat dissipation device for the problem that the above-mentioned electronic equipment water cooling system cannot adapt to the increase of heating elements in the existing electronic equipment
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Embodiment Construction
[0018] Such as Figure 1-3 Shown is a schematic diagram of an embodiment of the water-cooling heat dissipation device of the present invention. The water-cooling heat dissipation device is directly used as a part of the electronic equipment casing (such as the back panel of the casing), thereby dissipating heat for all internal components of the entire electronic equipment.
[0019] The water-cooling heat dissipation device includes a cold plate 11 , a water channel spacer 12 , a base plate 13 and a cover plate 14 , wherein the water channel spacer 12 and the cover plate 14 are respectively welded on the cold plate 11 , and the cold plate 11 is welded on the base plate 13 . The above components can be made of aluminum alloy or other materials with high heat conduction efficiency.
[0020] The outer surface of the cold plate 11 (ie the surface facing away from the electronic components in the electronic device) is provided with a concave second mounting position 112 , and the ...
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The invention relates to a water-cooling heat sink. The water-cooling heat sink comprises a cold plate, a water channel distance sleeve, a substrate and a cover plate, wherein a groove is formed on the outer surface of the cold plate; the inner surface of the water channel distance sleeve is adhered to the groove to form a water flow channel with the groove together; the water channel distance sleeve is provided with an inlet and an outlet of the water flow channel; the inner surface of the cover plate is covered on the water channel distance sleeve, and water pipe joints are arranged on the outer surface of the cover plate corresponding to the inlet and the outlet of the water flow channel respectively; a through hole of which the size is larger than that of the outer outline of the cover plate and is smaller than that of the outer outline of the cold plate is formed on the substrate; and the edge of the cold plate is welded with the edge of the through hole. In the water-cooling heat sink, heat dissipation components which are directly connected with water pipes are arranged on the substrate, so that the internal temperature of electronic equipment can be effectively reduced; and the water pipe joints are arranged outside the substrate so as to effectively prevent cooling liquid from leaking to the electronic equipment and damaging electronic elements.
Description
technical field [0001] The invention relates to a heat dissipation device for electronic equipment, and in particular, the invention relates to a heat dissipation device for realizing heat dissipation in a water-cooled manner. Background technique [0002] As the power of electronic components and semiconductor components increases, the power density of electronic equipment increases sharply, and at the same time, the calorific value of these electronic components and semiconductor components increases greatly. In order to reduce the heat generated by electronic components and semiconductor components in electronic equipment and maintain a stable operating temperature, cooling devices must be used. Most conventional cooling devices for electronic equipment include heat sinks and fans, wherein a substrate surface of the heat sink has a plurality of heat sinks, and the fan is disposed on top of the heat sinks. [0003] As the power of electronic equipment increases, air cooli...
Claims
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IPC IPC(8): G06F1/20H05K7/20
Inventor 向世松郭海军柏子平
Owner SUZHOU INOVANCE TECH CO LTD