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Headphone ear tips with sound conduit mounting structure

A technology of earplugs and earphones, which is applied to internal auditory earphones, earpieces/earphone accessories, earphones to reduce environmental noise, etc. It can solve the problems of lowering sound quality, attenuation of environmental noise, and no sealing of earplugs.

Inactive Publication Date: 2011-04-27
MONSTER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Second, typical hard polymer earplugs do not provide substantial ambient noise attenuation, partly due to the aforementioned fit issues, and partly due to the properties of typical hard polymers
However, eartips that uniformly contain polyurethane foam may not create a good seal, which reduces sound quality
In addition, the property of polyurethane foam is that it absorbs high frequencies, which may also cause additional damage to the sound quality

Method used

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  • Headphone ear tips with sound conduit mounting structure
  • Headphone ear tips with sound conduit mounting structure
  • Headphone ear tips with sound conduit mounting structure

Examples

Experimental program
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Embodiment Construction

[0021] Such as Figure 1A As shown in , in one embodiment, the earplug 1 may comprise a pointed inner sleeve of one material surrounded by an outer layer of a second material. In one embodiment, the inner sleeve may be polymer and the outer layer is foam. In this embodiment, the inner sleeve may have a protruding mushroom-shaped flange at the tip for better sealing of the auditory canal and better transmission of all frequencies into the auditory canal. In another alternative embodiment, the outer surface may be treated with an antimicrobial and / or bactericidal treatment (e.g., microbiological protection or functionally equivalent technology) having antimicrobial and / or bactericidal qualities.

[0022] In another embodiment of the inventive concept ( Figure 1B ), an earplug consisting of two contiguous layers of material: an outer layer 30 and an inner padding 40 . These layers work together to achieve an earplug 1 that is more adhesive, fits better in shape in the ear c...

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PUM

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Abstract

An ear tip is disclosed herein comprising two or more contiguous materials, in combination with a sound conduit structure containing one ore more rigid materials, wherein the ear tip mounts upon said sound conduit structure.

Description

[0001] priority claim [0002] This application claims priority based on Provisional Application Serial No. 61 / 239,714, filed September 3, 2009. technical field [0003] The present invention relates generally to earphones and, more particularly, to earphone ear tips for use with means for providing signals. Background technique [0004] In-ear headphones are becoming increasingly popular with the listening public, especially with the proliferation of small digital media players. They are convenient due to their small size and low profile, and generally cost less than larger over-ear headphones. However, the typical hard polymer earplugs associated with in-ear headphones suffer from two major disadvantages. [0005] First, even though some IEMs come with a wide range of different sized ear tips, proper fit can always be a problem. As such, there is no single general ear tip shape that will fit all users. Furthermore, earphones that are homogeneously composed of typical ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1016H04R1/1083
Inventor 诺埃尔·李戴维·梁
Owner MONSTER