Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof

A circuit board and patch technology, which is applied in the circuit repair patch structure and its production, circuit board and repair fields, can solve problems such as pad falling off, line breaking, circuit board scrapping, etc., to ensure orderliness and aesthetics, The effect of avoiding scrap and reducing production cost

Active Publication Date: 2011-04-27
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, when the above phenomenon occurs, for circuit boards with relatively simple circuits, the circuit board can be repaired by using metal leads; for precision circuit boards with relatively complex circuits, due to size restrictions, it is not suitable to use Metal leads are used for repairing, and phenomena such as line breakage, pad drop-off, and IC drop-off may cause the entire circuit board to be scrapped, and because the cost of each single board is getting higher and higher, this will cause high price losses and indirectly increase The production cost of the circuit board

Method used

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  • Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof
  • Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof
  • Circuit repair paster structure and manufacturing method thereof as well as circuit board and repair method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0028] The circuit repair patch structure provided in this embodiment is a circuit repair patch group, including a plurality of circuit repair patches, such as figure 1 As shown, this embodiment is a rectangular metal frame, and a plurality of circuit repair patches 10 are arranged in the inner frame. And a plurality of circuit repair patches 10 of a single size. That is to say, the repaired circuit pattern in this embodiment is single, and when pads of the same or similar shape and size fall off on the circuit board, the circuit repair patch 10 in this embodiment can be used for repair.

[0029] Of course, in the circuit repair patch structure of this embodiment, the size and shape of the circuit repair patch 10 are not limited, and can be any shape and size.

[0030] The circuit repair patch structure provided in this embodiment can provide multiple circuit repair patches, that is, can provide circuit repair patches in batches for processes such as circuit board assembly, a...

Embodiment 2

[0032] The circuit repair patch structure provided in this embodiment is also a circuit repair patch group, including a plurality of circuit repair patches, such as figure 2 As shown, it is the same as Embodiment 1. This embodiment is a rectangular metal frame, and a plurality of circuit repair patches 10 are arranged in the inner frame. The difference from Embodiment 1 is that this embodiment includes circuit repair patches 10 of various shapes. Patch 10 includes oval pad-shaped patch 101, line-shaped patch 102, square pad-shaped patch 103 and circular pad 104, etc., and each shape of circuit repair patch 10 includes at least one size. That is, the circuit patterns for repairing in this embodiment are diverse. When there is a break or shedding phenomenon on the circuit board, the corresponding circuit repair patch 10 of the same or similar shape and size can be used in this embodiment. The circuit pattern of the damaged part Make tinkering.

[0033] Of course, in the circu...

Embodiment 3

[0044] This embodiment can be called addition method, such as Figure 4 shown, including:

[0045] S21, using a steel plate as a carrier substrate, and chemically cleaning the steel plate;

[0046] This step is mainly to remove impurities and dirt on the surface of the steel plate, and to make the surface of the steel plate smooth and flat.

[0047] Certainly, carrier substrates of other materials may also be used in this step.

[0048] S22, pasting a dry film on the surface of the steel plate;

[0049] S23, transferring the pattern of the prepared circuit repair patch structure to the surface of the steel plate by exposure and development;

[0050] After this step, the part of the surface of the steel plate corresponding to the circuit repair patch structure will be exposed, and the other parts will be covered with a dry film. According to actual requirements, the pattern of the circuit repair patch structure can be set, and the pattern of the circuit repair patch structu...

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PUM

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Abstract

The embodiment of the invention discloses a circuit repair paster structure and a manufacturing method thereof as well as a circuit board and a repair method thereof, which relates to the field of manufacturing of a printed circuit board and aims at effectively solving the problem that a circuit board is scrapped as a result of circuit breakage, bonding pad break-off, IC (integrated circuit) break-off and other phenomena. The circuit repair paster structure comprises one or more circuit repair pasters corresponding to original circuit patterns of at least one damaged part of a circuit board, wherein the shapes and the dimensions of the circuit repair pasters are the same with or are similar to those of the corresponding original circuit patterns of the damaged part, and the circuit repair pasters can replace the corresponding original circuit patterns to be connected with other circuit patterns of the circuit board. The invention can be used for manufacturing a circuit board.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacture, in particular to a circuit repair patch structure and a manufacturing method thereof, a circuit board and a repair method. Background technique [0002] With the rapid development of the electronics industry, the requirements for circuit boards are getting higher and higher. The circuit boards have begun to move towards high-density packaging with fine lines, small holes, and multiple layers, and the degree of precision has gradually increased. Due to the limitations of the assembly process and circuit board manufacturing process, during the assembly process of the circuit board, the circuit board is prone to single or multiple circuit breakage, pad drop-off, IC (Integrated Circuit, integrated circuit) drop-off, etc., resulting in circuit board The board is damaged and cannot be used normally. [0003] In the prior art, when the above phenomenon occurs, for circuit boards with re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/22
Inventor 黄云钟
Owner NEW FOUNDER HLDG DEV LLC
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