Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards

A multi-layer circuit board, non-linear change technology, applied in the direction of multi-layer circuit manufacturing, etc., can solve the problems of layer deviation and dimensional expansion and shrinkage tolerance, so as to solve the layer deviation and dimensional expansion and shrinkage tolerance, and improve product reliability. , the effect of improving the alignment

Inactive Publication Date: 2011-04-27
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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Problems solved by technology

[0008] The invention provides a classification compensation method for the non-linear change of core board size in the manufacture of multi-layer circuit

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  • Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards
  • Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards
  • Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0033] As a specific implementation of the method for classifying and compensating nonlinear changes in the size of the core board for multi-layer circuit board manufacturing in the present invention, such as figure 2 As shown, take the manufacture of an 8-layer printed circuit board as an example. An 8-layer printed circuit board includes inner and outer layers. Wherein, the outer layer refers to the outer element surface and welding surface of the...

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Abstract

The invention discloses a method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards, which comprises the following steps of: A. classifying factors affecting the deformation of core board materials; B. designing a test pattern on an inner negative film; C. measuring the distance of the test pattern on the inner negative film; D. transferring the test pattern on the inner negative film to an inner core board; E. blackening and browning multiple layers of circuit boards; F. laminating the circuit boards, and measuring the distance of the test pattern on the inner core board after the lamination; G. calculating the expansion and shrinkage distance of the inner core board of the multilayer circuit boards; H. creating a compensation database in accordance with the classification of the step A, and optimizing the design dimension of the inner core board of the multilayer circuit boards. By using the technical scheme described in the invention, problems of deviation between layers and out-of-tolerance of expansion and shrinkage dimension appear during the lamination of the multilayer circuit boards can be solved, the dimension accuracy of the finished product and alignment accuracy between core board layers are improved, and the reliability of the product is improved.

Description

technical field [0001] The present invention relates to a multilayer PCB (Printed Circuit Board, printed circuit board, printed circuit board) board size change classification compensation method, especially relates to a multilayer printed circuit board in the lamination manufacturing process of layer deviation and size increase A classification compensation method for the non-linear change of the core plate size caused by the over-shrinkage deviation. Background technique [0002] The manufacturing process of multilayer printed circuit boards generally includes: material cutting → inner layer production → blackening / browning → lamination → subsequent processes. In the manufacturing process of multilayer printed circuit boards, it is generally a process of laminating multiple core boards, prepregs and copper foils under high temperature and high pressure conditions in the lamination process. After lamination of multi-layer circuit boards, the core board generally shrinks in...

Claims

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Application Information

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IPC IPC(8): H05K3/46
Inventor 余玉方
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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