Device for performing precise supercooled polishing to tiny spheres
A sphere, lapping and polishing technology, which is applied in the field of processing devices for precision ultra-cold lapping and polishing of tiny spheres by means of ultrasonic vibration polishing, which can solve problems such as polishing pad damage, overheating, and corrosion resistance decline
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[0022] The technical solution of the present invention will be further elaborated below in conjunction with the accompanying drawings.
[0023] like Figure 1~4 As shown, the embodiment of the present invention is provided with an automatic feeding mechanism, a grinding and polishing mechanism and a feeding mechanism.
[0024] The automatic feeding mechanism is provided with a funnel-shaped raw material box 1, a turntable 2, a base 3 and a feeding pipe 4, the funnel-shaped raw material box 1 is arranged on the upper part of the turntable 2, the turntable 2 is arranged on the base 3, and the turntable 2 is provided with 4 Holes arranged in an array. There is a gap between the discharge port of the funnel-shaped raw material box and the rotating disk 2 . Base (cuboid base) 3 is provided with 1 hole. Feeding pipe 4 links to each other with the hole of base 3, and the size of the hole on the base 3, the size of the discharge opening of funnel-shaped raw material box 1, the size...
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