Method of bonding metallic members, and metallic bonded body

Abstract

The invention provides a method of bonding metallic members and a metallic bonded body. By respectively abutting first and second outer diameter sections (11, 12) of a second metallic member (10) against first and second inner diameter sections (4, 5) of a first metallic member (1), and energizing the first metallic member (1) and the second metallic member (10) using a pair of electrodes (21, 22) while pressurizing both metallic members (1, 10) in an axial direction thereof, a first junction (P1) where the first inner diameter section (4) and the first outer diameter section (11) are bonded and a second junction (P2) where the second inner diameter section (5) and the second outer diameter section (12) are bonded are formed between both metallic members (1, 10), and a gap (15) in which the metals do not come into contact with each other is formed between both junctions (P1, P2) over a predetermined axial length. Accordingly, a high joint strength can be secured using less energy for bonding.

Description

technical field [0001] The present invention relates to a joining method of metal parts and a metal joined body, the method comprising facing a first metal part provided with an opening and having an outer peripheral wall capable of partially contacting an inner peripheral wall part of the first metal part surrounding the opening. In the case where the second metal member of the first part is pressed in the axial direction, the joining method is performed by resistive heating generated by energization. Background technique [0002] Conventionally, as one of the so-called ring mash bonding methods, a bonding method disclosed in Japanese Patent Laid-Open Publication No. 2004-17048 (Patent Document 1) is known. Specifically, in the method disclosed in Patent Document 1, a hollow first metal member and a second metal member having an outer diameter slightly larger than the inner diameter of the first metal member are stacked in the axial direction, and The inner peripheral surf...

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Problems solved by technology

[0005] However, the problem with the method disclosed in Patent Document 1 is that when the bonding area between the first metal member and the second metal member is to be increased for the purpose of further improving the bonding strength, it is necessary to increase the bonding area accordingly. pressure and current values, resulting in larger equipment

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