Heat pump type hot water supply apparatus

A hot water supply device and heat pump technology, applied in the field of heat pump water supply devices, can solve the problems of lowering, the heating performance cannot correspond to the outdoor temperature, and the heating performance cannot be used, so as to improve the condensation capacity and reduce the maximum management temperature. , The effect of high defrosting performance

Active Publication Date: 2011-05-25
LG ELECTRONICS INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, according to the prior art heat pump water heater, the heating performance cannot correspond to the outdoor air temperature when the outdoor temperature is low or the average outdoor

Method used

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  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus
  • Heat pump type hot water supply apparatus

Examples

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Embodiment Construction

[0035] Hereinafter, embodiments of the present invention that can achieve the above objects will be described with reference to the drawings.

[0036] figure 1 It is a schematic structural diagram of an embodiment of a heat pump water supply device according to the present invention.

[0037] Such as figure 1 As shown, the heat pump water supply device according to this embodiment includes: a refrigeration cycle device 3 that uses refrigerant to heat water and supplies it to places 1 and 2 that require hot water supply.

[0038] Places 1 and 2 that require hot water supply may include: a heating unit 1 that heats the room with water heated by refrigerant; Hot water unit 2. However, details of the heating unit 1 and the hot water supply unit 2 will be described later.

[0039] The refrigeration cycle device 3 may include a cascade cycle unit 4 and a gas injection mechanism 5 .

[0040] The cascade cycle unit 4 may include: a cascade heat exchanger for heat exchange between...

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PUM

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Abstract

The invention provides a heat pump type hot water supply apparatus, comprising a cascade circulation unit, comprising: a cascade circulation heat exchanger making a first coolant of a low temperature refrigeration circulation perform heat exchange with a second coolant of a high temperature refrigeration circulation, the water coolant heat exchanger heating water during condensation of the secondcoolant of the high temperature refrigeration circulation is connected with a position requiring heat supply and a water circulating path. The heat pump type hot water supply apparatus comprises a coolant injection path and a gaseous coolant adjustment valve. The coolant injection path may be split between a cascade heat exchanger and an evaporator of a low temperature refrigeration cycle to inject coolant into a low pressure side compressor, or between a water coolant heat exchanger and a cascade heat exchanger to inject coolant into a high pressure side compressor of a high temperature refrigeration cycle. The gaseous coolant adjustment valve may be provided in the coolant injection path and is adjusted to correspond to a load of a destination. Via the above structure, high temperature water can be effectively supplied to places requiring hot water supply, reduction of heating efficiency due to outdoor low temperature in cold zones can also be effectively prevented.

Description

technical field [0001] The present invention relates to a heat pump water supply device, in particular to a heat pump water supply device which utilizes a refrigerant circulation device to heat indoor heated water. Background technique [0002] Generally speaking, a heat pump is a refrigeration and heating device that transfers heat from a low temperature to a high temperature or from a high temperature to a low temperature by using the heat of heat generation or condensation of a refrigerant. [0003] A heat pump includes a compressor, a condenser, an expansion mechanism, and an evaporator. In recent years, in order to minimize the consumption of fossil fuels, heat pump water heaters that use refrigerant to heat water and heat indoor floors have become a trend of development. [0004] However, according to the prior art heat pump water heating device, it cannot be used in areas with low outdoor temperature or low average outdoor temperature, such as cold areas, the heating ...

Claims

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Application Information

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IPC IPC(8): F24H4/02
CPCF25B2700/21161F24D19/1072F25B2600/2509Y02B30/52F25B7/00Y02B30/12F24D3/08F25B2339/047F25B1/10F25B2400/13F24D17/02Y02B30/123F24D3/18F25B2341/0662F25B2400/23F24D2200/24F25B41/39F25B30/02F25B49/02F25B41/30F25B43/00F25B41/20F25B2500/31
Inventor 陈深元李应烈金范锡朴相炅
Owner LG ELECTRONICS INC
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