Circuit board film-adhering method
A circuit board and film sticking technology, which is applied in chemical instruments and methods, lamination devices, lamination auxiliary operations, etc. Problems such as open circuit in the post-process to achieve the effect of reducing open circuit/notch scrap, improving product quality rate, and improving product yield rate
Active Publication Date: 2013-06-19
江西红板科技股份有限公司
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- Description
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- Application Information
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Problems solved by technology
The traditional dry film laminating process is simple to operate, but it does not fill the dents and pits on the circuit board surface, which may easily cause open circuits / gap scrapping in the subsequent process, resulting in the failure to improve the product yield rate.
Method used
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[0020] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0021] Such as figure 1 As shown, the present invention provides a kind of circuit board film sticking method, and it comprises the steps:
[0022] In step 1, a PCB substrate is provided, and the PCB substrate is chemically cleaned and mechanically brushed.
[0023] Step 2, pass the PCB substrate through a pair of oppositely arranged water-absorbing cotton rods, and evenly coat deionized water on the board surface of the PCB substrate through the water-absorbing cotton rods to form a layer of deionized water film. The temperature of the deionized water is 10-20℃, conductivity 200-10US. In the present invention, a wet film sticking device is used to form a layer of deionized water film on the board surface of the PCB substrate. The spray dev...
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Abstract
The invention provides a circuit board film-adhering method. The method comprises the following steps of: 1, providing a printed circuit board (PCB) substrate, performing chemical cleaning on the PCB substrate and brushing the substrate mechanically; 2, allowing the PCB substrate to pass through a pair of absorbent wool rods which is arranged opposite to each other and uniformly coating deionized water on the surface of the PCB substrate through the absorbent wool rods to form a layer of deionized water film; 3, drying the PCB substrate of which the surface is coated with the deionized water film and preheating the PCB substrate to the temperature of between 25 and 35 DEG C; and 4, feeding the dried and preheated PCB substrate into a film pressing device, and adhering a dry film on the surface of the PCB substrate through the film pressing device at the conveying speed of 2 to 4 m / min under the pressure of 3.5 to 4.0 KG / cm<2> at the temperature of 100 to 105 DEG C. In the method, the layer of deionized water thin film is coated on the substrate surface before film adhering by using the characteristic of the water-solubility of the dry film, and concave spots on a circuit board can be flattened so as to improve the yield of a product.
Description
technical field [0001] The invention relates to the field of circuit boards, in particular to a method for pasting a film on the surface of a circuit board. Background technique [0002] A printed circuit board (PCB: Printed Circuit Board) is an insulating board with a printed circuit, including an insulating substrate and a printed circuit. According to the types of printed circuit boards, there are three types: rigid, flexible, and rigid-flexible, and according to the number of layers, there are single-sided, double-sided, and multi-layer boards. [0003] The traditional film lamination process for printed circuit boards is a dry film lamination process. The dry film lamination process is characterized in that the surface of the copper foil is dry when the copper foil is hot-pressed. The traditional dry film laminating process is simple to operate, but it does not fill the dents and pits on the circuit board surface well, and it is easy to cause open circuit / gap scrapping...
Claims
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IPC IPC(8): B32B37/06B32B37/10B32B38/18
Inventor 宋安
Owner 江西红板科技股份有限公司