Method and system for repairing miniature passive element on printed circuit board (PCB)

Abstract

The invention provides a method and system for repairing a miniature passive element on a printed circuit board (PCB). The method comprises the following steps: providing a detector for analysis based on the PCB; providing a laser device for outputting a laser beam according to position data to irradiate a weld pad of the passive element with incorrect electrical characteristics so as to melt the welding material of the passive element with incorrect electrical characteristics; providing a pick-and-place device for taking down the passive element with incorrect electrical characteristics from the PCB according to the position data, wherein, the welding material of the passive element is molten and the molten welding material is remained on the PCB; placing a correct passive element at the passive element with incorrect electrical characteristics by utilizing the pick-and-place device so that the weld pad of the correct passive element is contacted with the molten welding material; and shutting off the laser device so that the welding material is cured, and then fixing the weld pad of the correct passive element at the cured welding material so as to completely repair the miniature passive element on the PCB.

Description

technical field [0001] The invention relates to a repair method and system for miniaturized passive components on a printed circuit board, in particular to a repair method and system for updating and repairing miniaturized passive components on a printed circuit board. Background technique [0002] With the advancement of the electronic application industry, the most noteworthy focus of mobile communication devices at present is the success of touch panel technology, and the application of mobile communication devices has successfully been pushed to another emerging market. World-renowned brands or R&D teams Both have successively announced to actively step into the R&D and production of this field. This market is a global high-tech competition. According to estimates, there is an annual demand of about 300 million products, and there is an increasing trend year by year. [0003] However, from the perspective of production cost and efficiency, the product design principles o...

AI Technical Summary

Problems solved by technology

[0005] 1. As a result of the use of 0201 components and the high density of components, passive components are prone to tombstones or wrong parts in the SMT process, and due to the high density and miniaturization of components, the cost of reworking the above-mentioned printed circuit boards is very high High, and the repair process is not ideal

For example, traditionally, the printed circuit board is heated with a heat gun or an oven. After the solder is melted, the tombstone or the wrong passive component is removed from the printed circuit board. Good passive components on the board or thermal damage to other electronic components

[0006] 2. If 01005 components are used, there is also the problem that passive components with tombstones or wrong parts cannot be reworked, so that the printed circuit board must be scrapped, but the components on the printed circuit board are objects with high unit prices. Therefore, scrap the above Printed circuit boards can cause significant losses in material components and cost

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