Method for depositing back electrode in solar cell production
A technology of solar cells and deposition methods, which is applied in the field of solar cell production, can solve problems such as the influence of the next process, low target utilization rate, and increased scrap rate, so as to achieve short vacuuming time, reduce production and maintenance costs, and utilize rate-enhancing effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2011-06-22
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to the field of solar cell production, in particular to a magnetron sputtering device for sputtering a back electrode on the back of a solar cell to realize the deposition method of the back electrode in solar cell production. Background technique
[0002] In the production process of amorphous silicon thin-film batteries, an important step is to deposit the back electrode after depositing the PIN layer as the power generation layer. The back electrode is used as one of the electrodes of the battery and can collect the current at every point on the battery. Increase the short-circuit current and improve the conversion efficiency of the battery, thereby improving the stability of the battery and the performance of the battery.
[0003] And because the conversion efficiency of the amorphous silicon thin film solar cell is low, the performance is not stable enough, and there is a phenomenon of light-induced degradation, the light abs...
Examples
Embodiment Construction
[0011] attached by figure 1 , 2 Shown: this method is to adopt the magnetron sputtering equipment of sputtering back electrode on the back of solar cell to realize through the following steps, described magnetron sputtering equipment is a tunnel type structural form, and it comprises sheet-feeding stage 1, exits Chip stage 2, buffer chambers 3, 4, heating chambers 5, 6, sputtering chamber 7, the buffer chambers 3, 4, heating chambers 5, 6, sputtering chamber 7 between each chamber Separated by a valve 8, two buffer chambers 3 and 4 arranged at both ends, two heating chambers 5 and 6 arranged side by side in the middle and a sputtering chamber 7 constitute the main body of the magnetron sputtering equipment. A vacuum system 9 is provided below each chamber of the main body of the injection equipment. The vacuum system 9 is connected to the buffer chambers 3, 4, the heating chambers 5, 6 and the sputtering chamber 7 through a vacuum pipeline 10.
[0012] The specific steps of ...