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Surface compound strengthening process for aluminum alloy material

An aluminum alloy material and surface compounding technology, which is applied in metal material coating process, superimposed layer plating, coating, etc., can solve the problems of poor wear resistance, low hardness, poor bonding strength, etc., and achieve wear resistance Good, high bonding strength, high hardness and wear resistance effect

Active Publication Date: 2013-02-06
NAXAU NEW MATERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve aluminum and aluminum alloy chemical plating Ni, Ni-P, Ni-W-P or electroplating Ni, Cr bonding strength is good, but hardness is low, wear resistance is relatively poor, and aluminum alloy material vacuum coating CrN, TiN, TiAlN, TiCN or DLC coatings have high hardness and good wear resistance, but the bonding strength with the substrate is poor. We provide a composite aluminum alloy surface that combines electroless plating or electroplating with vacuum coating technology. Strengthening treatment technology can improve the bonding strength between the vacuum coating and the aluminum alloy substrate, and at the same time make the surface of the aluminum alloy substrate have higher hardness and wear resistance

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  • Surface compound strengthening process for aluminum alloy material
  • Surface compound strengthening process for aluminum alloy material

Examples

Experimental program
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Effect test

Embodiment 1

[0023] In the first step, the plating thickness of aluminum and aluminum alloy surface is 2μm Ni plating:

[0024] Electroplating Ni layer process: mechanical polishing → gasoline or carbon tetrachloride degreasing → mounting → chemical degreasing (alkali etching process) → descaling or light emission in a 1:1 nitric acid and 5% hydrofluoric acid solution ( Acid etching process) → water washing → activation → water washing → nickel plating → water washing → blow-drying.

[0025] (1) Alkaline etching process: Na 2 CO 3 30g / L, Na 3 PO 4 30g / L, additive 2~4 g / L, OP-10 emulsifier 0.5~1 mL / L, temperature 75~85℃, time 30~60s;

[0026] (2) Acid etching process: HNO 3 3 parts, 1 part HF, a small amount of water, temperature room temperature, time 20-40s;

[0027] (3) Nickel electroplating solution formula and process parameters (the name should correspond to the above process flow, the terminology should be consistent): nickel sulfate (NiSO 4 ·7H 2 O) 250g / L, nickel chloride (NiCl 2 ·6H 2 O...

Embodiment 2

[0032] The first step: the electroless plating thickness of aluminum and aluminum alloy surface is 10μm Ni coating.

[0033] In the second step, the aluminum alloy mold after the Ni plating treatment is cleaned by an ultrasonic cleaning line to remove the electroless plating residue, and then placed in a constant temperature drying oven at a constant temperature of 75°C for 2 hours.

[0034] The third step: Hollow cathode ion plating deposition of CrN coating process and parameters:

[0035] Fix the dried aluminum alloy mold on the support, put it into the hollow cathode coating machine, put Cr plating material in the crucible of the coating machine, adjust the rotation speed of the workpiece support to 6-10 rpm, and pump to the background vacuum 2.5-3.0×10- 3 Pa, turn on the heater at the same time and raise the temperature to 200-300℃; turn on the Ar gas flow valve, adjust the vacuum chamber to about 0.5-1 Pa, apply a negative bias voltage of 300-800 V to the substrate, and perform...

Embodiment 3

[0037] The first step: the electroless plating thickness of aluminum and aluminum alloy surface is 4μm Ni-P coating.

[0038] In the second step, the aluminum alloy mold after the Ni-P plating treatment is cleaned by an ultrasonic cleaning line to remove the electroless plating residue, and then placed in a constant temperature drying oven at a constant temperature of 80°C for 1.5 hours.

[0039] The third step: magnetron sputtering ion plating deposition of two TiN coatings, the deposition temperature is 200 ℃, the thickness of the two TiN coatings is 4 μm.

[0040] The technical solutions of electroplating and electroless plating of the present invention are all well-known technologies, and therefore will not be described in detail. Multi-arc ion plating, hollow cathode ion plating, and magnetron sputtering ion plating also use the existing low deposition temperature (180-250°C) vacuum coating technology, and other technical solutions of the present invention can be implemented.

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Abstract

The invention discloses a surface compound strengthening process for an aluminum alloy material, aiming to solve the problems that chemical plating of Ni, Ni-P and Ni-W-P or electroplating of Ni and Cr for aluminum and aluminum alloy has good bonding strength but low rigidity and poorer wear resistance, and vacuum coatings of CrN, TiN, TiAlN, TiCN or DLC for an aluminum alloy material have high rigidity and good wear resistance but poorer bonding strength with a substrate. The surface compound strengthening process disclosed by the invention comprises the following steps: firstly, plating a 2-10mu m thick gradient transition layer on the surface of an aluminum alloy substrate, then baking for 1-2 hours at constant temperature of 75-85 DEG C in a dry environment, and finally depositing one or multiple coatings of CrN, TiN, TiAlN, TiCN or DLC on the aluminum alloy substrate by a vacuum coating technology. The surface compound strengthening process can improve the bonding strength between the vacuum coating and the aluminum alloy substrate, and simultaneously the surface of the aluminum alloy substrate has higher rigidity and wear resistance.

Description

Technical field [0001] The invention relates to the technical field of surface strengthening of aluminum alloy materials, in particular to a surface composite strengthening process for aluminum alloy materials that combines electroplating or chemical plating with vacuum plating. Background technique [0002] In recent decades, with the continuous improvement of aluminum smelting and technology and the breakthrough of basic problems of aluminum materials, the aluminum alloy industry has been able to flourish, and aluminum alloy materials have been widely used, and aluminum alloy material molds have become more and more widely used. This is one example. At this stage, the share of aluminum alloy molds in the United States has accounted for more than 20% of the total molds, but it is still less than 0.2% in China and is still in the stage of development. Aluminum alloy processing performance is excellent, and the cutting speed is 40% higher than that of die steel, thus greatly redu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C28/00
Inventor 不公告发明人
Owner NAXAU NEW MATERIALS CORP
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