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Wafer-level package micro-ball automatic collection, supply and circulation equipment

A wafer-level packaging and automatic collection technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of complex structure, pollution, waste of the environment, etc. The effect of high ball success rate and high utilization rate

Active Publication Date: 2011-07-13
SHANGHAI WEISONG IND AUTOMATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The overall effect of this method is better, but the structure of the residual ball removal device made separately is more complicated, and the way of collecting the residual balls and discarding them is also a waste and pollutes the environment

Method used

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  • Wafer-level package micro-ball automatic collection, supply and circulation equipment
  • Wafer-level package micro-ball automatic collection, supply and circulation equipment
  • Wafer-level package micro-ball automatic collection, supply and circulation equipment

Examples

Experimental program
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Effect test

Embodiment

[0025] A wafer-level packaging microsphere automatic collection and ball supply circulation equipment, its structure is as follows figure 1 As shown, the mechanism includes a microsphere collection device 1 and a ball supply circulation device 2. The ball supply circulation device 2 is arranged on the top of the microsphere collection device 1 and is fixed on the Z-direction motion machine. direction up and down.

[0026] The microsphere collection device 1 comprises a ball planting net plate 11, an X motion mechanism 12, a Y motion mechanism 13, a Z motion mechanism 14 and a linear guide rail 15, and the Y motion mechanism 13 is located on one side of the ball planting net plate 11, One end of the X-direction movement mechanism 12 is erected on the Y-direction movement mechanism 13, and the other end is nested on the linear guide rail 15. The linear guide rail 15 is arranged on the other side of the ball planting net plate 11, horizontal to the Y-direction movement mechanism ...

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PUM

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Abstract

The invention relates to wafer-level package micro-ball automatic collection, supply and circulation equipment. The mechanism comprises a micro-ball collection device and a micro-ball supply and circulation device, wherein the micro-ball supply and circulation device is arranged on the upper part of the micro-ball collection device, is fixed on a slide block of a Z-direction moving mechanism and can move up and down. Compared with the prior art, micro-balls in a micro-ball supply bottle can fall onto a ball attachment screen plate through a micro-ball supply conduit by controlling a micro-ball dropping steel band; a micro-ball suction mechanism is used for sucking redundant micro-balls which flow out of a ball attachment head during ball attachment; and the redundant micro-balls are sucked into a collection bottle through an air pipe so as to realize automatic cyclic utilization of the micro-balls.

Description

technical field [0001] The invention relates to semiconductor chip packaging equipment, in particular to a wafer-level packaging microsphere automatic collection and ball supply circulation equipment. Background technique [0002] Wafer-level ball planting machine is a high-end semiconductor chip packaging equipment, which is used to accurately place microballs (solder balls, copper balls, silver balls, gold balls, etc. according to the material) onto the wafer that has been coated with flux superior. One of its core technologies is the microsphere automatic ball supply, automatic collection and microsphere circulation system. At present, the diameter of balls used in wafer-level ball planting machines is generally 70 μm to 300 μm, and microspheres with a diameter of 65 μm have appeared and have a tendency to be further miniaturized. This puts forward higher requirements for the automatic collection of microspheres and the ball supply circulation system Require. [0003] ...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/60
Inventor 刘劲松赵凯李小平
Owner SHANGHAI WEISONG IND AUTOMATION