Manufacturing method of high-alignment interlayer conducting structure of embedded type circuit
A manufacturing method and a technology of interlayer conduction, applied in the direction of electrical connection formation of printed components, etc., can solve problems such as circuit short circuit, poor alignment between copper window and termination pad, and achieve the effect of avoiding circuit short circuit and improving product production capacity
Inactive Publication Date: 2011-07-13
KINSUS INTERCONNECT TECH SUZHOU CORP
View PDF0 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] However, in the prior art, since the copper window has been opened before the laminates are laminated, if the copper window and the stop pad (stop pad) are poorly aligned due to the misalignment between the layers after lamination, the lead A part of the through hole directly runs through the entire second layer board (as shown in area A in the figure), so there is a risk of short circuit
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0010] The implementation of the present invention will be described in more detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it after studying this specification.
[0011] refer to Figure 2 to Figure 6 , a schematic diagram and a top view of the implementation steps of the method for fabricating the high-alignment interlayer conduction structure of the buried line according to the present invention. Firstly, the first circuit 7 and at least one target point 5 are formed on the first laminate 1, and the second circuit 11 is formed on the second laminate 3, and then the second laminate 3 and the first laminate 1 are pressed together , the second laminate 3 covers the first circuit 7 and the target point 5, such as figure 2 shown.
[0012] Then, if image 3 As shown, the reading target point 5 is aligned and penetrates the second layer board 3 on the stop pad (stop pad) of the first circuit 7 by a drilling method, so...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a manufacturing method of a high-alignment interlayer conducting structure of an embedded type circuit. The main points of the manufacturing method are that: a laser copper window is not formed before veneer sheets are laminated together, and a laser drilling processing procedure is performed to form a conducting hole after the veneer sheets are laminated together, so that although interlayer deviations exist during the lamination of the veneer sheets, the risk of circuit short circuiting caused by poor alignment of outer layer conducting holes when the laser copper window is formed first and then the laser drilling is performed can be avoided because the laser copper window is not formed, and the product manufacturing capacity can be improved under the condition that the interlayer deviations are not improved.
Description
technical field [0001] The invention relates to a method for making a high-parallel interlayer conduction structure of an embedded line, in particular, laser copper windows are not carried out before the laminates are laminated, and laser drilling is directly performed after the laminates are laminated. Via holes are formed, so the risk of line shorts can be avoided without improving interlayer offset. Background technique [0002] In order to increase the area that can be wired, the existing printed circuit boards are mostly multi-layer boards, and then use through holes, blind holes or buried holes to connect the lines between the laminates, but because the multi-layer board is a Layer by layer is pressed together, so there is a problem of alignment deviation between the laminates. [0003] refer to figure 1 , which is a schematic diagram of the existing interlayer conduction structure, such as figure 1 As shown, the first circuit 7 and the target point 5 are formed on ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H05K3/42
Inventor 张谦为林定皓吕育德
Owner KINSUS INTERCONNECT TECH SUZHOU CORP