Package of light emitting diode
A technology of light-emitting diodes and lead-out parts, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of reduced sticking force of brackets, splitting of filling parts, damage, etc., to prevent low sticking force, reduce thermal deformation, and prevent damage. Effect
Active Publication Date: 2013-04-03
昆山琉明光电有限公司
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Problems solved by technology
However, in this mode, the filling of the first lead-out part and the second lead-out part is prone to splitting or damage
In addition, LED chips generate a lot of heat during operation, and molds formed of thermoplastics such as phenylpropanolamine are also prone to thermal deformation
With the passage of time, the thermoplastic resin will easily lead to the reduction of the sticking force of the bracket, yellowing, etc., which will reduce the reliability of the entire LED package
Method used
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Embodiment Construction
[0023] The present invention will be further described below in conjunction with accompanying drawing and embodiment:
[0024] like figure 1 , 2 As shown in , 3 , the light emitting diode package 1 of this embodiment includes a light emitting diode chip 100 , a bracket 200 and a mold 300 . Wherein: the light-emitting diode chip 100 is formed by bonding a P-type semiconductor and an N-type semiconductor, and light is generated when current is emitted from the P-type semiconductor to the N-type semiconductor;
[0025] There is a groove portion 214 in the middle part of the bracket 200, such as figure 2 As shown, a portion of the first lead-out portion 210 is recessed toward the lower side, and the LED chip 100 is installed in the groove portion 214 . In this embodiment, the anode and the cathode of the LED chip 100 correspond to the first lead-out part 210 and the second lead-out part 220 respectively, and one of the anode or the cathode of the light-emitting diode chip 100 ...
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The invention relates to a package of a light-emitting diode, which comprises a light-emitting diode chip, a support for mounting the light-emitting diode chip and a die for mounting the support, wherein the support comprises a first leading-out part and a second leading-out part, a spacing interval is arranged between the first leading-out part and the second leading-out part, the widths at two ends of the spacing interval in the extension direction are larger than the middle width, the die comprises a filled part matched with the current status of the spacing interval, and the first leading-out part and the second leading-out part are mounted on two sides of the filled part of the die respectively; and a reinforcing part is upwards convexly arranged on the filled part of the die, and the reinforcing part is gradually upwards convex from the middle of the filled part to the two ends. As for the package of the light-emitting diode, the die adopts thermosetting resin to fill between the first leading-out part and the second leading-out part, thereby being capable of effectively preventing the phenomenon that the breakage occurs in a gap, reducing the thermal deformation of the die and effectively preventing the phenomena of low sticking force, yellowing and the like.
Description
technical field [0001] The invention relates to a light emitting diode package. Background technique [0002] The light-emitting diode can be used as a device after being packaged to be used in lighting equipment, image sensors, display devices, and backlight units of flash lamps by utilizing its light-emitting function. [0003] A general light-emitting diode is composed of a light-emitting diode chip, a bracket for installing the light-emitting diode chip, and a mold for installing the bracket. The bracket includes a first lead-out part and a second lead-out part which are separated from each other, and the first lead-out part and the second lead-out part are respectively connected with the anode and the cathode of the LED. After the bracket is installed on the mold, the space between the first lead-out part and the second lead-out part is filled with thermoplastic resin phenylpropanolamine (Polyphthalamide). However, in this mode, the filling of the first lead-out part ...
Claims
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IPC IPC(8): H01L33/48H01L33/62H01L33/60H01L33/56
Inventor 吴承玄
Owner 昆山琉明光电有限公司