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Packaging structure and lead frame thereof

A technology of packaging structure and lead frame, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of reduced reliability of packaging structure, increased material cost, and unstable structure, etc., to increase lead strength, Low cost and improved reliability

Inactive Publication Date: 2011-07-27
SHANGANPIN
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the soft material properties of silver, in the known technology, if only silver is used for metal surface treatment, the formed silver layer will be too soft to make the wiring of electronic components difficult, causing the structure to be unstable, and making the entire packaging structure drop in reliability
Another known lead frame is to use nickel layer \ palladium layer \ gold layer as the metal surface treatment, wherein the material price of palladium is 50 times more expensive than silver, so the material cost will increase

Method used

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  • Packaging structure and lead frame thereof
  • Packaging structure and lead frame thereof
  • Packaging structure and lead frame thereof

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Embodiment Construction

[0035] The package structure and its lead frame according to preferred embodiments of the present invention will be described below with reference to related drawings, wherein the same components will be described with the same symbols.

[0036] Please refer to Figure 1A and Figure 1B shown, where Figure 1A is a top view of the lead frame of the preferred embodiment of the present invention, Figure 1B is the lead frame edge Figure 1A The cross-section of the line A-A in the middle. It should be noted that in Figure 1B In the figure, for the sake of clarity, the relative proportions of the wires 11 and the metal composite layer 12 are not actual proportions.

[0037] The lead frame 1 of this embodiment can be applied in the packaging structure of light-emitting diodes, integrated circuits, or other electronic components. Here, one lead frame is taken as an example. It should be noted that in actual manufacturing, there may be multiple The lead frame is manufactured tog...

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Abstract

The invention discloses a packaging structure, which comprises a lead frame and grain crystals. The lead frame is provided with a plurality of leads and a metal composite bed. The metal composite bed is respectively arranged at one part of each lead, and is provided with a nickel layer and a silver layer in sequence from the inside to the outside; and the grain crystals are at least electrically connected with one lead. Therefore, the nickel layer can be used as a support structure of the silver layer due to the characteristics of harder material of the nickel layer. In this way, not only the advantage of lower cost of the silver layer material can be maintained, but also the lead strength of the packaging structure can be increased through the nickel layer.

Description

technical field [0001] The invention relates to a packaging structure and its lead frame. Background technique [0002] In various electronic components, such as light-emitting diode chips, a lead frame is often used as a load bearing, and the electronic components are electrically connected to external circuits through the wires of the lead frame. [0003] In the known lead frame, the material of the lead frame body is usually copper, iron or alloys thereof, and the inner lead part or the die pad is usually metal-finished by using, for example, silver. ) to prevent the wire from being oxidized when exposed to air for too long. [0004] However, due to the soft material properties of silver, in the known technology, if only silver is used for metal surface treatment, the formed silver layer will be too soft to make the wiring of electronic components difficult, causing the structure to be unstable, and making the entire packaging structure reliability drops. Another known...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L25/00
CPCH01L2224/92247H01L24/97H01L2224/48091H01L2224/73265H01L2924/12041H01L2924/14
Inventor 陈宏男
Owner SHANGANPIN
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