Connector

Abstract

The invention provides a connector used for connecting a splicing substrate and a rigid substrate. The connector comprises an insulated main body which contains at least one terminal, the terminal is electrically connected with the splicing substrate; the bottom of the insulated main body is provided with at least one welding leg correspondingly conducted with the terminal, and the welding legs are welded at one face of the rigid substrate; and a connection device is electrically connected with the rigid substrate and the splicing substrate through the connector. By means of the connector provided by the invention, the fact that the substrates are connected by wire soldering tin or the terminals are spliced in the prior art is avoided, the processing production process is improved to a great extend and time and labor are saved.

Description

technical field [0001] The invention relates to the field of electrical circuits, in particular to the improvement of a connector connecting multiple circuit substrates. Background technique [0002] At present, when designing substrate connections in some electronic circuits, the main methods used are: using wire solder to connect; using terminal-to-terminal docking or using direct soldering between substrates to connect electrical or signal production processes, and many of the above connection methods All have deficiencies in varying degrees: the use of wire welding connection, because the metal layer as the solder formation surface is formed of copper and nickel, etc., so the adhesion to the metal layer as the solder exclusion surface is weakened, resulting in metal At the same time, in order to make the adhesion of the solder good, the solder film must be formed in advance, resulting in low productivity; the production process of using terminal to terminal is complicate...

AI Technical Summary

Problems solved by technology

[0002] At present, when designing substrate connections in some electronic circuits, the main methods used are: using wire solder to connect; using terminal-to-terminal docking or using direct soldering between substrates to connect electrical or signal production processes, and many of the above connection methods All have deficiencies in varying degrees: the use of wire welding connection, because the metal layer as the solder formation surface is formed of copper and nickel, etc., so the adhesion to the metal layer as the solder exclusion surface is weakened, resulting in metal At the same time, in order to make the adhesion of the solder good, the solder film must be formed in advance, resulting in low productivity; the production process of using terminal to terminal is complicated; the cost is too high and the reliability is not high

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