Automatic charging system of semiconductor packaging equipment
A technology for automatic feeding and packaging equipment, applied in semiconductor/solid-state device manufacturing, transportation and packaging, conveyor objects, etc., can solve problems affecting process and finished product quality, high manufacturing costs, high maintenance costs, and difficult economical use, etc. Achieve the effect of improving equipment utilization efficiency, improving production efficiency and low cost
Active Publication Date: 2011-08-03
NANTONG FUJITSU MICROELECTRONICS
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Problems solved by technology
[0003] The current automatic feeding equipment is bulky, and it is difficult for packaging factories with high space utilization to achieve economical use of space; at the same time, the existing automatic feeding equipment has a complex structure, high failure rate, manufacturing costs, and maintenance. The cost is very high; especially for some packaged products with asymmetrical sides, the outer dimensions of the frame or carrier board carrying the product are quite different, the compatibility of fully automatic equipment is often very low, and the utilization rate of the equipment is low
[0004] Although the traditional manual loading method occupies less space, it is inefficient, and it is easy to twist the frame or carrier board for semiconductor packaging during manual transfer, which will affect the subsequent process and the quality of the finished product
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[0026] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar extensions without violating the connotation of the present invention, so the present invention is not limited by the specific implementations disclosed below.
[0027] Secondly, the present invention is described in detail by means of schematic diagrams. When describing the embodiments of the present invention in detail, for convenience of explanation, the schematic diagrams are only examples, which should not limit the protection scope of the present invention.
[0028] The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0029] Such as figure 1 , figure 2 As shown, an automatic loading system for s...
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The invention relates to an automatic charging system of semiconductor packaging equipment, which mainly comprises a charging platform, a material basket, a material ejecting device, a fork frame device and a material pushing device. Compared with the prior art, in the automatic charging system of the semiconductor packaging equipment requested to be protected in the invention, the whole set of frameworks or carrier plates are sent to a specified position by using the material ejecting device, the frameworks or the carrier plates are individually separated from each other through the embedded type fork frame device, and the full-automatic charging of materials of the equipment is realized through pushing a product into a rail by the material pushing device; the system has the advantages of simple structure, no occupation of space, stable operation and low cost; moreover, the structure of the system is easy to adjust when different products are machined, and the production efficiency and equipment utilization efficiency are greatly improved.
Description
technical field [0001] The invention relates to semiconductor technology, in particular to an automatic feeding system for semiconductor packaging equipment. Background technique [0002] In the semiconductor packaging process, the product has to go through the process of loading, operation and unloading in each process. [0003] The current automatic feeding equipment is bulky, and it is difficult for packaging factories with high space utilization to achieve economical use of space; at the same time, the existing automatic feeding equipment has a complex structure, high failure rate, manufacturing costs, and maintenance. The cost is high; especially for some packaging products with asymmetrical sides, the frame or carrier board that carries the product has a large difference in dimensions, the compatibility of fully automatic equipment is often very low, and the utilization rate of the equipment is low. [0004] Although the traditional manual loading method occupies less...
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Inventor 赵新民
Owner NANTONG FUJITSU MICROELECTRONICS