Cooling and heating device for cooked food

A heating device and cooked food technology, applied in applications, home appliances, kitchen appliances, etc., can solve the problems of inability to evenly heat or cool food, loss of food moisture, waste of food, etc., to shorten the time and avoid temperature differences , The effect of extending the service life

Inactive Publication Date: 2011-08-10
UNIV OF SHANGHAI FOR SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This will not only waste food, but also affect the body
[0003] In the prior art, there is only a separate cooling or heating device for food, and the effect of uniform heating or cooling of the food cannot be achieved during the heating or cooling process, and the moisture loss of the food is caused, and the original deliciousness is lost

Method used

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  • Cooling and heating device for cooked food
  • Cooling and heating device for cooked food
  • Cooling and heating device for cooked food

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Embodiment Construction

[0025] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention will not be limited.

[0026] Please see first figure 1 , figure 1 It is a structural schematic diagram of the cooling and heating device for cooked food of the present invention. As seen in the figure, a cooling and heating device for cooked food includes a processing chamber 1, a vacuum pump 3 fixed on the outside of the top of the processing chamber 1 and a heat transfer device 2 fixed on the top of the processing chamber 1, The top of the heat transfer device 2 is hollow, and an external gas pipe is connected to the vacuum pump 3; one side of the processing chamber 1 is provided with a thermocouple 4 socket for placement of the thermocouple; the other end of the thermocouple is connected with A temperature controller 5, the other end of the temperature controller 5 is respectively connected ...

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PUM

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Abstract

The invention discloses a cooling and heating device for cooked food, which comprises a processing chamber, a vacuum pump, a heat transfer device, a thermoelectric couple, a temperature controller and a lifting table, wherein the heat transfer device consists of a heat transfer pipe installation plate, a heat transfer cover connected above the periphery of the heat transfer pipe installation plate and a plurality of heat transfer pipes which are fixed to the lower surface of the heat transfer pipe installation plate and are distributed uniformly. By the cooling and heating device, the temperature difference of each part inside cooked food in the cooling or heating process can be prevented effectively, the cooling and heating time of the cooked food can be shorten greatly, and the moistureof the food is not lost in the cooling process.

Description

technical field [0001] The invention relates to a cooling and heating device, in particular to a cooling and heating device for cooked food. Background technique [0002] Southerners like to have porridge and noodles for breakfast, and students or working people are busy every morning after breakfast and rushing to school or work. But usually people can not eat immediately because the food is just cooked and too hot when having meals every day. But sometimes, in order to catch up with the time, they will swallow breakfast in embarrassment. Hot food will burn the mouth and esophagus, but after the food cools down, they often cannot catch up with the time. Therefore, some people go to school or work hungry. This not only wastes food, but also affects the body. [0003] In the prior art, there is only a separate cooling or heating device for food, and the effect of uniform heating or cooling of the food cannot be achieved during the heating or cooling process, and the moistur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A47J27/00A47J36/00
Inventor 宋晓燕刘宝林李琳徐海峰
Owner UNIV OF SHANGHAI FOR SCI & TECH
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