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Manufacture method of flexible and rigid composite circuit board

A soft-hard composite, flexible circuit board technology, applied in the direction of multi-layer circuit manufacturing, assembling printed circuit with electrical components, forming electrical connection of printed components, etc. easy to fall off

Active Publication Date: 2011-08-10
TRIPOD WUXI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The above-mentioned manufacturing methods are difficult to achieve a reliable automated production process
Moreover, in the above-mentioned first method, the reliability and mechanical strength of the connection between the soft and hard boards are not good, and they are easy to fall off or have poor electrical contact.
In the above-mentioned second method, when the electrical connection holes are formed, one end of the semi-finished flexible and rigid circuit board is a rigid circuit board, and the other end is a flexible circuit board, which is very inconvenient in the subsequent manufacturing process or transportation.

Method used

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  • Manufacture method of flexible and rigid composite circuit board
  • Manufacture method of flexible and rigid composite circuit board
  • Manufacture method of flexible and rigid composite circuit board

Examples

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Embodiment Construction

[0066] Figure 1A to Figure 9C It is a manufacturing process diagram of the manufacturing method of one embodiment of this invention. Please refer to Figure 1A and Figure 1B , first provide the first rigid substrate 100 . Figure 1A is a schematic top view of the first rigid substrate 100, Figure 1B for Figure 1A Schematic cross-section of 1B to 1B. Such as Figure 1B As shown, opposite sides of the first rigid substrate 100 respectively have a first surface 101 and a second surface 102 , and the first surface 101 has a first copper layer 103 (first metal layer). Of course, the second surface 102 may also have an alignment mark (not shown) formed by another metal layer (such as a copper layer). In one embodiment, the first rigid substrate 100 is a thermosetting material, such as a glass fiber cloth substrate (eg Flame Retardant 4, FR4 substrate), which has been widely used in printed circuit boards.

[0067] Such as Figure 1A As shown, a first cutting line 110 and...

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Abstract

The invention discloses a manufacture method of a flexible and rigid composite circuit board. The method comprises the steps of: completely clamping a flexible circuit board between two rigid substrates and laminating into a whole; and then, forming cutting lines to remove the excess parts of the rigid substrates and expose the flexible circuit board.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a soft-hard composite circuit board. Background technique [0002] With the continuous growth and diversification of the electronic product market, the applications of circuit boards are also diversified. In most electronic products, circuit boards are indispensable components. The circuit board is used to carry electronic components and circuits between the electronic components. Circuit boards can be divided into rigid circuit boards, flexible circuit boards, and rigid-flex composite circuit boards. Among them, rigid-flex circuit boards have high design flexibility, so they can be widely used in various electronic products. [0003] In the existing rigid-flex circuit board, the circuit of the rigid circuit board and the circuit of the flexible circuit board are respectively formed first, and then the rigid circuit board and the flexible ...

Claims

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Application Information

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IPC IPC(8): H05K3/40H05K3/46H05K3/36
Inventor 杨伟雄林信成徐海白金龙许博胜
Owner TRIPOD WUXI ELECTRONICS
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