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Thermal analysis modeling method for data extraction

A modeling method and data extraction technology, applied in electrical digital data processing, special data processing applications, instruments, etc., can solve the problem of large modeling workload, complex finite element programming process, model modeling, and difficulty in dividing grids. problem, to reduce the workload

Inactive Publication Date: 2011-08-17
BEIHANG UNIV
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  • Abstract
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  • Claims
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Problems solved by technology

However, writing finite element programs has the following disadvantages: (a) difficult for complex model modeling and grid division; (b) heavy modeling workload; (c) complicated finite element programming process
It can be seen that there are a series of limitations whether using finite element software for thermal analysis or writing finite element programs for thermal analysis, it is necessary to explore new thermal analysis methods to solve the shortcomings of existing methods

Method used

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  • Thermal analysis modeling method for data extraction
  • Thermal analysis modeling method for data extraction
  • Thermal analysis modeling method for data extraction

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Embodiment

[0060] Example: The invention is illustrated below with respect to an example of thermal analysis of a spacecraft flexible component in a space thermal environment. The flexible parts of spacecraft are affected by solar radiation, solar radiation reflected by the earth and infrared heat flow of the earth in space, and flexible parts will radiate a large amount of heat into space. Due to the harsh space thermal environment, the temperature of flexible parts may change drastically, which may cause various effects on the spacecraft, and this kind of analysis is generally modeled by writing finite element programs. In this embodiment, the simplification of solar panels of spacecraft Model - three-dimensional plate as the research object, due to the addition of radiation boundary conditions, the finite element equations of thermal analysis become:

[0061] C T · + ( K c ...

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Abstract

The invention provides a thermal analysis modeling method for data extraction, which comprises the following steps of: firstly, establishing a model in finite element software, and dividing grids; secondly, calculating coefficients changing with time changes on the basis of information of the finite element software; thirdly, extracting a constant coefficient matrix without changing with the timechanges on the basis of the finite element software; fourthly, configuring a solving environment; fifthly, setting initial conditions and boundary conditions; and sixthly, resolving the model. When the modeling method is adopted, the powerful modeling and grid-dividing functions of the finite element software can be utilized; the problem of difficulty in establishing a complex model and dividing the grids is solved; the workload of the finite element modeling can be reduced; and complex boundary conditions can be loaded conveniently and quickly.

Description

technical field [0001] The invention belongs to the field of thermal analysis finite element modeling, in particular to a thermal analysis modeling method for data extraction. Background technique [0002] The finite element method is a common method for thermal analysis of specific objects in theoretical research and engineering applications. Due to its versatility and effectiveness, it has been highly valued by the engineering technology community and widely used in various fields such as national defense and construction. [0003] Since the appearance of the finite element method, this method has been widely used in the thermal analysis of specific objects in theoretical research and engineering applications at home and abroad. At the same time, a large number of commercial finite element software have emerged. Due to the powerful modeling and meshing functions of finite element software, and strong solving capabilities, thermal analysis of various objects and conditions ...

Claims

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Application Information

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IPC IPC(8): G06F17/50
Inventor 王江云
Owner BEIHANG UNIV
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