Automatic charging system of semiconductor packaging equipment

Abstract

The invention relates to an automatic charging system of semiconductor packaging equipment. The system mainly comprises a conveying device, a track adjusting device, a basket, an ejection device, a distribution device, a power device and a track sensor. Compared with the prior art, the automatic charging system which the invention requests to protect has the following beneficial effects: the ejection device is used for conveying the whole group of frames or carrier plates to the assigned positions and then the distribution device is used for realizing single separation of the frames or the carrier plates to realize full automatic charging of the equipment; the system has a simple structure, does not occupy space, is stable to operate, has low cost and greatly improves the production efficiency and the equipment utilization efficiency; and the structure of the system is easy to adjust when different products are processed.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to an automatic feeding system for semiconductor packaging equipment. Background technique [0002] In the semiconductor packaging process, the product has to go through the process of loading, operation and unloading in each process. [0003] The current automatic feeding equipment is bulky, and it is difficult for packaging factories with high space utilization to achieve economical use of space; at the same time, the existing automatic feeding equipment has a complex structure, high failure rate, manufacturing costs, and maintenance. The cost is very high; in addition, due to the complex structure design, it often takes a lot of time to replace the feeding parts when producing products of different specifications, which has a certain impact on production efficiency. [0004] Although the traditional manual loading method occupies less space, it is inefficient, and it is easy to twist ...

AI Technical Summary

Problems solved by technology

[0003] The current automatic feeding equipment is bulky, and it is difficult for packaging factories with high space utilization to achieve economical use of space; at the same time, the existing automatic feeding equipment has complex structures, high failure rates, manufacturing costs, and maintenance. The cost is high; in addition, due to the complex structural design, it often takes a lot of time to replace the feeding parts when producing products of different specifications, which has a certain impact on production efficiency

[0004] Although the traditional manual loading method occupies less space, it is inefficient, and it is easy to twist the frame or carrier board for semiconductor packaging during manual transfer, which will affect the subsequent process and the quality of the finished product

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