On-chip integration paster antenna

Abstract

The invention provides an on-chip integration paster antenna which comprises an on-chip device and an outer-chip device connected with the on-chip device, wherein the on-chip device comprises mutually fitted silicon wafers, an isolating layer and a metal paster unit, and the isolating layer is located between the silicon wafers and the metal paster unit; the outer-chip device comprises a dielectric layer and a metal land; the metal paster unit is connected with the dielectric layer; and the dielectric layer is located between the metal paster and the metal land. By using the on-chip integration paster antenna, the radiance of the antenna can be improved; and the manufacturing process is simple, and the cost is low.

Description

technical field

[0001] The invention relates to the technical field of wireless communication, in particular to an on-chip integrated patch antenna. Background technique

[0002] Wireless communication has developed rapidly in recent years. With the increasing demand for low-cost, broadband, high-speed and small wireless devices, especially for millimeter-wave band devices, System-on-Chip (SoC) has become an important solution to address the above requirements. The existing system-on-chip (SoC) and system-in-package (SIP) technology can already integrate all parts of the receiver's RF front-end, intermediate frequency, and digital baseband circuits into a tiny package. In order to realize a complete system on chip, integrated antenna technology on chip becomes the main problem we need to study.

[0003] In the millimeter wave frequency band, 60GHz is very attractive. For high-speed Internet, data communication, especially wireless personal area network (WPAN) applications...

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