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BGA (Ball Grid Array) component repairing method and fixture

A technology for rework and components, which is applied in the field of BGA component rework methods and rework fixtures, can solve the problems of low rework efficiency of rework fixtures, achieve the effects of improving rework efficiency, simple structure, and guaranteed disassembly quality

Inactive Publication Date: 2011-08-31
苏剑锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] The purpose of the invention is to disclose a kind of BGA component rework jig and rework method, to solve the defect that the existing rework method and rework fixture rework efficiency is low

Method used

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  • BGA (Ball Grid Array) component repairing method and fixture
  • BGA (Ball Grid Array) component repairing method and fixture
  • BGA (Ball Grid Array) component repairing method and fixture

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as Figure 6 As shown, the first embodiment of the BGA component repair method of the present invention includes:

[0043] Step S602: placing the PCB board on the rework chassis and fixing it;

[0044] Step S604: Cover and fix the reworked upper cover on the reworked chassis, so that the reworked upper cover and the reworked chassis tightly package the PCB board, and make the BGA components on the PCB board that need to be reworked from the hollow window of the reworked upper cover to exposed;

[0045] Step S606: the reworked upper cover and the reworked chassis packaged in one body are reflow soldered, so that the BGA components to be reworked are separated from the PCB board;

[0046] Step S608: remove the BGA components to be repaired from the PCB board, separate the repaired upper cover from the repaired chassis, and take out the PCB board;

[0047] Step S610: using a mounter to paste qualified BGA components on the PCB, and fixing the PCB on the rework chas...

Embodiment 2

[0052] Such as Figure 7 As shown, the second embodiment of the BGA component repair method of the present invention includes:

[0053] Step S702: placing the PCB board on the rework chassis and fixing it;

[0054] Step S704: Cover and fix the rework upper cover on the rework chassis, so that the rework upper cover and the rework chassis tightly package the PCB board, and make the BGA components on the PCB board that need to be reworked from the hollow window of the rework upper cover to exposed;

[0055] Step S706: pre-clamp the collet of the disassembly clip on the BGA component to be repaired, and clamp the support of the disassembly clip on the rework cover;

[0056] Step S708: reflow soldering the packaged reworked upper cover and reworked chassis to separate the BGA components to be reworked from the PCB board;

[0057] Step S710: Press down the lifting arm of the removal clip, the connecting rod converts the reciprocating motion of the lifting arm into the clamping m...

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Abstract

The invention discloses a BGA (Ball Grid Array) component repairing method and fixture for overcoming the defect of lower repairing efficiency of the traditional repairing method and the traditional repairing fixture. In order to realize the purpose, the invention discloses the BGA component repairing fixture which comprises a repairing chassis and an upper repairing cover, wherein the repairing chassis and the upper repairing cover can be fitted vertically to form a whole for packaging a PCB (Printed Circuit Board) inside, a hollow window is arranged on the upper repairing cover and fitted to a BGA component to be repaired on the PCB, and the BGA component is exposed from the hollow window. The BGA component repairing fixture can realize the disassembly repairing of a plurality of BGA components in one reflow soldering process, and prevents thermal impaction of the reflow soldering to the PCB from causing damage on the PCB, thereby greatly increasing repairing efficiency of the BGA component and ensuring repairing quality of the BGA component.

Description

technical field [0001] The invention relates to the technical field of BGA component repair, in particular to a BGA component repair method and a repair fixture. Background technique [0002] Existing BGA (Ball Grid Array, Ball Grid Array) component rework usually uses a BGA component rework station to disassemble and install the BGA component. The BGA component rework station generally consists of temperature curve generation, temperature monitoring, circuit board fixing, BGA component automatic alignment, solder paste printing, etc. The heating methods of BGA component rework equipment include infrared, hot air and laser. [0003] The defects of existing BGA component rework methods are: [0004] 1. Each temperature thermal shock can only repair a single BGA component, and the number of thermal shocks to the assembled circuit board with multiple BGA components is more; [0005] 2. The automation rate of repair equipment is low, the repair efficiency is low, and the succ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H01L21/60H05K13/04B23K3/08
Inventor 苏剑锋
Owner 苏剑锋
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