BGA (Ball Grid Array) component repairing method and fixture

A technology for rework and components, which is applied in the field of BGA component rework methods and rework fixtures, can solve the problems of low rework efficiency of rework fixtures, achieve the effects of improving rework efficiency, simple structure, and guaranteed disassembly quality
CN102169809AInactive Publication Date: 2011-08-31่‹ๅ‰‘้”‹
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
่‹ๅ‰‘้”‹
Publication Date
2011-08-31
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a BGA (Ball Grid Array) component repairing method and fixture for overcoming the defect of lower repairing efficiency of the traditional repairing method and the traditional repairing fixture. In order to realize the purpose, the invention discloses the BGA component repairing fixture which comprises a repairing chassis and an upper repairing cover, wherein the repairing chassis and the upper repairing cover can be fitted vertically to form a whole for packaging a PCB (Printed Circuit Board) inside, a hollow window is arranged on the upper repairing cover and fitted to a BGA component to be repaired on the PCB, and the BGA component is exposed from the hollow window. The BGA component repairing fixture can realize the disassembly repairing of a plurality of BGA components in one reflow soldering process, and prevents thermal impaction of the reflow soldering to the PCB from causing damage on the PCB, thereby greatly increasing repairing efficiency of the BGA component and ensuring repairing quality of the BGA component.
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Description

technical field

[0001] The invention relates to the technical field of BGA component repair, in particular to a BGA component repair method and a repair fixture. Background technique

[0002] Existing BGA (Ball Grid Array, Ball Grid Array) component rework usually uses a BGA component rework station to disassemble and install the BGA component. The BGA component rework station generally consists of temperature curve generation, temperature monitoring, circuit board fixing, BGA component automatic alignment, solder paste printing, etc. The heating methods of BGA component rework equipment include infrared, hot air and laser.

[0003] The defects of existing BGA component rework methods are:

[0004] 1. Each temperature thermal shock can only repair a single BGA component, and the number of thermal shocks to the assembled circuit board with multiple BGA components is more;

[0005] 2. The automation rate of repair equipment is low, the repair efficiency is low, and the succ...

Claims

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