Soft and hard combined plate structure capable of avoiding fracture of soft plate

A soft-rigid combination board and soft board technology, applied in the direction of layered products, etc., can solve the problems of disconnection, machine failure, and the soft board 4 is easily squeezed, so as to ensure the service life and avoid excessive stress concentration.

Inactive Publication Date: 2011-09-07
ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

like figure 1 As shown, under normal circumstances, since the cross-sections of the upper and lower hard boards 3 are flush, the soft board 4 at the transition between the soft and hard boards is easily squeezed under strong pressure during the production process. , there is a great stress
This kind of extrusion may appear as a disconnection of the flexible board, or the flexible board has no bad performance in a short period of time, but in the subsequent assembly of the whole machine, or even a disconnection during the consumer's use, resulting in machine failure Happening

Method used

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  • Soft and hard combined plate structure capable of avoiding fracture of soft plate
  • Soft and hard combined plate structure capable of avoiding fracture of soft plate
  • Soft and hard combined plate structure capable of avoiding fracture of soft plate

Examples

Experimental program
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Embodiment Construction

[0009] Such as figure 2 As shown, the present invention includes a soft board 1 arranged on the inner side, a hard board 2 arranged on both sides of the soft board 1, and the hard board 2 on the front and back sides of the soft board 1 is connected with the soft board 1. Fit height varies. According to requirements, the setting ratio of the lamination height difference between the front and back sides of the soft board 1 of the hard board 2 is less than 0.5 mm.

[0010] In the present invention, the bonding heights of the rigid boards 2 on both sides of the soft board 1 and the soft board 1 are set differently, and the difference in the bonding height is used to make the soft and hard boards fit together more smoothly. The soft-hard transition areas on the front and back of the flexible board 1 are staggered to avoid stress concentration on the flexible board 1 and cause disconnection of the flexible board 1 , thereby ensuring product quality and product life.

[0011] To s...

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PUM

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Abstract

The invention discloses a soft and hard combined plate structure and aims at providing the soft and hard combined plate structure, which can avoid the fracture of a soft plate when pressing the soft plate and hard plates. The soft and hard combined plate structure comprises the soft plate (1) arranged on the inner side and the hard plates (2) arranged on the front side and the back side of the soft plate (1), and the joint heights of the hard plates (2) on the front side and the back side of the soft plate (1) with the soft plate (1) are different. The difference between the joint heights of the hard plates (2) on the front side and the back side of the soft plate (1) is set to be not less than 0.5mm. The soft and hard combined plate structure can be widely applied in the field of design of soft and hard combined plates in electronic equipment.

Description

technical field [0001] The invention relates to a structure for preventing soft and hard boards from breaking. Background technique [0002] Rigid-flex boards take into account the double-sided installation of hard boards, better rigidity, and thickness that meets structural requirements, and also take into account the advantages of flexible boards that can be bent arbitrarily. Rigid-flex boards are more and more widely used in electronic equipment. At present, the structure of flexible and rigid boards adopts the structural form of the inner layer of the soft board and the outer layer of the hard board. During production, the soft board in the inner layer is usually prepared first, and then pressed together with the hard board. In the area without the hard board, the hard board needs to be punched off first, or the pattern is punched out and removed in the subsequent process. Excess hardboard. Such as figure 1 As shown, under normal circumstances, since the cross-sectio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/02
Inventor 陈国辉
Owner ZHUHAI YUANSHENG ELECTRONICS SCI & TECH
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