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Glass packaging structure and manufacturing method thereof

A technology of glass encapsulation and manufacturing method, which is applied in cold cathode manufacturing, electrode system manufacturing, discharge tube/lamp manufacturing, etc. It can solve problems such as long time consumption, air leakage, and rising production costs, and achieve cost saving and strong Anti-moisture performance, the effect of avoiding the risk of air leakage

Inactive Publication Date: 2011-09-07
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

A getter box needs to be placed on the panel in order to carry out vacuum pumping through a vacuum pump. In this process, it not only consumes a long time (up to 20 hours), but also utilizes the extra getter box (Getter box). box), which will increase the production cost
In addition, after vacuum pumping, there is a risk of air leakage when cutting and sealing the tube

Method used

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  • Glass packaging structure and manufacturing method thereof
  • Glass packaging structure and manufacturing method thereof
  • Glass packaging structure and manufacturing method thereof

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Embodiment Construction

[0022] Specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. figure 1 A cross-sectional view of a glass package structure according to an aspect of the present invention is shown. refer to figure 1 , the glass package structure includes: a first glass substrate 110, a second glass substrate 120, a first laser curing glue 131, a second laser curing glue 132, a first ultraviolet light curing glue 141, a second ultraviolet light curing glue 142, a first The glass frame 150 and the second glass frame 160 . Wherein, the second glass substrate 120 is arranged parallel to one side of the first glass substrate 110, the first laser curing glue 131 is located on a surface of the first glass substrate 110, and forms a first closed ring, and the second laser curing glue 132 It is located on the side of the second glass substrate 120 corresponding to the first glass substrate 110 and forms a second closed ring, the si...

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Abstract

The invention provides a glass packaging structure and a manufacturing method thereof. The glass packaging structure comprises a first glass substrate, a second glass substrate, a laser glass curing adhesive and an ultraviolet light curing adhesive. The laser glass curing adhesive is clamped between the two glass substrates to form a closed ring shape; and the ultraviolet light curing adhesive is clamped between the two glass substrates and outside the laser glass curing adhesive. The manufacturing method comprises the following steps of: providing the first glass substrate and the second glass substrate; coating the laser glass curing adhesive on the two glass substrates so that the closed ring shape is formed by the laser glass curing adhesive; pre-curing the laser glass curing adhesive; coating the ultraviolet light curing adhesive on the two glass substrates to surround the laser glass curing adhesive; adhering the two glass substrates in pair; feeding the two glass substrates into an oven to be baked and pumping in vacuum; curing the ultraviolet light curing adhesive by an ultraviolet light before breaking the vacuum; and curing the laser glass curing adhesive by laser. In the invention, the advantages of the two kinds of adhesive materials are combined to save time and cost and prevent air leakage.

Description

technical field [0001] The invention relates to a glass packaging structure and a manufacturing method thereof, in particular to a packaging structure of two different adhesive materials. Background technique [0002] When manufacturing Field Emission Displays (FED, Field Emission Display or Field Effect Display), packaging materials are used as a medium to combine the two substrates, and the packaging between the display panels is performed to prevent external water vapor and oxygen from entering the interior of the panel and affecting the light-emitting elements. function. [0003] Traditional encapsulation methods use only one encapsulation material, and each encapsulation material has its advantages and disadvantages. For example, Laser Frit Glue has strong resistance to water vapor, but it needs to be cured by laser; UV Glue can be made in a vacuum chamber, but its resistance to water vapor is weak. Therefore, the use of a packaging material can only take care of one ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J29/86H01J9/26
Inventor 薛俊辉吕仁贵黄胜铭廖启宏
Owner AU OPTRONICS CORP
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