A kind of hybrid thin film and preparation method thereof, and flexible oled display

Abstract

The invention discloses a hybrid film and a preparation method for the same, and a flexible OLED displayer. The hybrid film comprises a plurality of composite element layers which are mutually superposed; the composite element unit comprises a first inorganic layer, a first organic layer and a second inorganic layer which are successively stacked; the organic layer and the inorganic layer are different in bending radius; and falling degrees of water blocking performances of packaging layers of different bending radiuses are different. Through adding the numbers of the inorganic / organic surface, the hybrid film and preparation method for the same, and the flexible OLED displayer can effectively improve flexibility of the packaging layer, can increase an interface and delay the invasion of water radon and can improve a sealing effect of an integral structure. Compared with a Vitex structure, the thickness of the hybrid film is low and the capability of blocking vapor on the side of the film is strong; besides, the capability of blocking vapor of the organic layer is weaker, and thus two layers of inorganic layers are adopted to coat the organic layer to further improve the effect of blocking vapor.

Description

technical field [0001] The invention relates to an OLED film, in particular to a hybrid film applied to a flexible OLED, a preparation method thereof, and a flexible OLED display. Background technique [0002] At present, Thin Film Encapsulation of Organic Light Emitting Diode (OLED) mostly adopts the structure of inorganic / organic multi-layer stacking. Analysis shows that in the case of a fixed thickness, increasing the number of stacking can effectively improve the resistance. The effect of water and oxygen, that is, the thickness of the single layer decreases and the interface increases, which increases the path of water and oxygen diffusion and prolongs the time of water and oxygen intrusion; when the thickness of the inorganic layer increases, the internal stress and defect density of the film increase, which weakens On the one hand, increasing the organic layer releases the stress of the inorganic film layer, on the other hand, it covers the defect position and improve...

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Problems solved by technology

[0005] The above-mentioned thin-film packaging structure has the following problems: 1. Inorganic / organic multi-layer stacking, the thickness is too large, such as Vitex reaches several microns, which not only reduces the light extraction efficiency of the device, but also weakens the adhesion performance of the film layer if the film thickness is too large , there is a risk of de-filming. On the other hand, a thicker organic layer has very limited water and oxygen blocking effect, while the defects and stress of an excessively thick inorganic layer are greatly increased. Therefore, in order to obtain better water blocking properties, it is difficult to reduce the stacking times and thickness. ; 2. Generally, the inorganic layer and the organic layer use different reactants and are carried out in different chambers. For example, the organic layer of Vitex needs to be cured, and the inorganic and organic layers are alternately carried out, which greatly increases the process time and improves the quantity. 3. The film-forming method of the inorganic layer is PECVD or sputtering. These film-forming methods may destroy the OLED device due to the bombardment of the plasma, form dark spots or even cause the device to fail to light up, which reduces the life and quality of the product. Rate

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