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Light-emitting device (LED) package component

A technology for light-emitting devices and packaging components, which is applied to electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problem of poor heat dissipation efficiency through gold wires 12, occupied by electrodes 10, and failure to optimize the light output area of ​​the light-emitting device. and other problems, to achieve the effect of good luminous efficiency and heat dissipation efficiency

Active Publication Date: 2013-06-19
EPISTAR CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the gold wire 12 must extend to the lead frame 6 and has a long length, the heat dissipation efficiency through the gold wire 12 is not good.
In addition, the electrode 10 occupies the chip area, resulting in a non-optimized light output area of ​​the light emitting device.

Method used

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  • Light-emitting device (LED) package component
  • Light-emitting device (LED) package component
  • Light-emitting device (LED) package component

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Embodiment Construction

[0030] The present invention will provide many different embodiments to illustrate different features of the present invention. The composition and configuration of each specific embodiment will be described in detail below to illustrate the spirit of the present invention, but these embodiments are not intended to limit the present invention.

[0031] The present invention discloses a novel light-emitting device (LED) package component and its manufacturing method, and exemplifies the manufacturing process of the embodiments of the present invention, and discusses the changes of these embodiments. In various exemplary illustrations and embodiments of the present invention, similar reference numerals denote similar components.

[0032] figure 2 Shown is a wafer 100 comprising light emitting devices 22 formed on a substrate 20 . In one embodiment, the substrate 20 is made of sapphire (transparent Al 2 o 3 ), or may also be formed of other materials with properties similar ...

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Abstract

A light-emitting device (LED) package component includes an LED chip and a carrier chip. The carrier chip includes a first bond pad and a second bond pad on a surface of the carrier chip and bonded onto the LED chip through flip-chip bonding, and a third bond pad and a fourth bond pad on the surface of the carrier chip and electrically connected to the first bond pad and the second bond pad, respectively. The first bond pad and the second bond pad are on a same side of the carrier chip facing the LED chip. The carrier chip further includes at least one through substrate via (TSV) connected to the first and second bond pads.

Description

technical field [0001] The present invention relates to a light emitting device (LED) packaging component, and in particular to an LED packaging structure including a through-substrate via (TSV). Background technique [0002] In recent years, optical devices such as light-emitting diodes (LEDs), laser diodes, and ultraviolet light optical detectors have been widely used. Group III nitrides, such as gallium nitride (GaN) and related alloys, have proven suitable for forming the optical devices described above. Group III nitrides have high energy band gaps and high electron saturation velocities, which also make them excellent choices for high temperature and high speed power electronic device applications. [0003] Due to the high equilibrium pressure of nitrogen at the general growth temperature, it is not easy to obtain bulk crystals of gallium nitride. Therefore, the GaN film layer and the respective LEDs are usually formed on other substrates that can meet the characteri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/62
CPCH01L2924/01322H01L2224/49107H01L2224/45144H01L33/62H01L2224/48091H01L2224/73265H01L2224/48464H01L2924/00014H01L2924/00H01L33/486H01L2224/48227H01L2924/12041H01L33/647H01L2924/00012
Inventor 王忠裕
Owner EPISTAR CORP