Circuit board film and circuit board manufacture method
A technology for the production of circuit board negatives and circuit boards, which is applied in the directions of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve the problems of waste of raw materials, fewer circuit boards, and limited number of circuit board patterns, and achieves a reduction in the number of printed circuit boards. cost, the effect of improving production efficiency
Inactive Publication Date: 2013-08-28
HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD +1
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Problems solved by technology
However, the size of a copper-clad base material is limited, which inevitably results in a limited number of circuit board patterns that can be typeset in the film of the corresponding size, and the subsequent number of circuit boards that can be produced per copper-clad base material is less , low production efficiency
At the same time, a large amount of copper foil of the copper-clad substrate is not utilized, wasting raw materials
Method used
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[0038] The circuit board backsheet and circuit board manufacturing method provided by the technical solution will be described in detail below in conjunction with the accompanying drawings.
[0039] see figure 1 , the shown circuit board 100 to be manufactured refers to the circuit board specified to be produced in the production order received by the circuit board manufacturer. Eight printed circuit boards 100 can be produced at one time from one copper-clad base material. The circuit board 100 to be manufactured includes a first product area 101 and a second product area 102 connected to the first product area 101 .
[0040] The first product area 101 is irregular in shape, that is, it is composed of multiple parts with different shapes and sizes. Specifically, the first product area 101 includes a first section 1011 , a second section 1012 , a third section 1013 parallel to the first section 1011 , and a fourth section 1014 parallel to the second section 1012 . The first...
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The invention relates to a circuit board film and a circuit board manufacture method. The circuit board film is used for manufacturing a circuit board comprising a first product zone and a second product zone connected with the first product zone. The circuit board film comprises at least one first product pattern array, at least one second product pattern array and at least one laminating zone pattern array. Each first product pattern and each second product pattern are used for respectively manufacturing a first product zone and a second product zone. Each first product pattern comprises a crimping zone pattern provided with a conducting layer pattern. Each laminating zone pattern comprises a conducting part pattern. Each conduction part pattern is connected with the second product pattern, so that the conducting layer pattern is connected with the conducting part pattern after the laminating zone is laminated with the crimping zone, and each first product pattern and the second product pattern are matched to form the pattern having the same shape and the size with the circuit board. The film can be used for producing more circuit boards in the same batch.
Description
technical field [0001] The invention relates to the technical field of circuit board production, in particular to a circuit board negative and a circuit board production method. Background technique [0002] After receiving the production order, the circuit board manufacturer will first assign a CAM (Computer assistant manufacturing, computer-aided manufacturing) engineer to complete the layout of the negatives in the man-machine interface with the help of design software according to the circuit board pattern specified in the order, and confirm the negatives by the QA engineer. After checking whether it is feasible in production, it is handed over to the production line production technician to organize the production operation according to the film. [0003] The production of circuit boards includes the processes of coating photoresist on the surface of the copper-clad substrate, laying a negative film on the surface of the photoresist, exposing, developing, electroplating...
Claims
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IPC IPC(8): H05K1/02H05K3/00
Inventor 郑建邦
Owner HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO LTD