Test probe

A test probe and probe insertion technology, applied in the field of test probes, can solve problems such as electrical contact damage
CN102197310AActive Publication Date: 2011-09-21泰科电子服务有限责任公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
泰科电子服务有限责任公司
Publication Date
2011-09-21

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Abstract

The present invention relates to a test probe (1) for mating with a connector (30) in a probe insertion direction (I), comprising a housing (2), an outer contact portion (8), the outer contact portion (8) supported by the housing (2) and extending away from the housing (2), said outer contact portion (8) supported by an elastically deformable outer biasing means (21) and being adapted to be deflected substantially perpendicular to the probe insertion direction (I) and at least one contact assurance means (19), said contact assurance means (19) connecting the outer contact portion (8) electrically conductively to the housing (2). To decrease the number of parts the contact assurance means (19) has at least one contact section (19c), said contact section (19c) pressed conductively against the housing (2) by being elastically deflected.
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Description

technical field

[0001] The invention relates to a test probe for mating with a connector in the direction of probe insertion, comprising: a housing; an outer contact portion supported by the housing and extending away from the housing, the outer contact portion being elastically Deformable outer biasing means supports and is adapted to be biased substantially at right angles to the probe insertion direction; and at least one contact assurance means conductively connects the outer contact portion to the housing. Background technique

[0002] Test probes are used for functional testing of printed circuit boards (PCBs). A variety of tip types and materials are available to suit nearly every application. In order to electrically connect the PCB to the probes, a connector is mounted on the PCB. As the size of integrated circuit components decreases and the packing density on printed circuit boards increases, the remaining space for housing connectors decreases. In this way, co...

Claims

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