Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Test probe

A test probe and probe insertion technology, applied in the field of test probes, can solve problems such as electrical contact damage

Active Publication Date: 2011-09-21
泰科电子服务有限责任公司
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The problem that arises with the state of the art is that, in particular, in the deflected state of the contact part, the electrical contact between the contact part and the electrical conductor of the connected test device, ie the test probe, can be broken

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Test probe
  • Test probe
  • Test probe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] First, an embodiment of a test probe configured in accordance with the present invention will be referred to figure 1 A description is provided showing a schematic side view of an exemplary embodiment.

[0040] The test probe 1 comprises an elongated housing 2 . In order to connect the test probe 1 to a (not shown) test device, the test probe 1 is provided with a connector part 3 which is formed as a snap connection. The lower end of the housing 2 has an opening 4 in which the insertion part is seated.

[0041] The housing 2 has a shoulder 6 on its outer cylindrical surface which acts as a stop when the test probe is mounted on the adapter plate. For example, the smaller diameter lower part of the housing 2 can be inserted into the hole of the adapter plate until the shoulder 6 is in position on a corresponding shoulder of the adapter plate. At the lower end of the lower part of the housing 2, the housing 2 is provided with a helical thread for fixing the housing 2 t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a test probe (1) for mating with a connector (30) in a probe insertion direction (I), comprising a housing (2), an outer contact portion (8), the outer contact portion (8) supported by the housing (2) and extending away from the housing (2), said outer contact portion (8) supported by an elastically deformable outer biasing means (21) and being adapted to be deflected substantially perpendicular to the probe insertion direction (I) and at least one contact assurance means (19), said contact assurance means (19) connecting the outer contact portion (8) electrically conductively to the housing (2). To decrease the number of parts the contact assurance means (19) has at least one contact section (19c), said contact section (19c) pressed conductively against the housing (2) by being elastically deflected.

Description

technical field [0001] The invention relates to a test probe for mating with a connector in the direction of probe insertion, comprising: a housing; an outer contact portion supported by the housing and extending away from the housing, the outer contact portion being elastically Deformable outer biasing means supports and is adapted to be biased substantially at right angles to the probe insertion direction; and at least one contact assurance means conductively connects the outer contact portion to the housing. Background technique [0002] Test probes are used for functional testing of printed circuit boards (PCBs). A variety of tip types and materials are available to suit nearly every application. In order to electrically connect the PCB to the probes, a connector is mounted on the PCB. As the size of integrated circuit components decreases and the packing density on printed circuit boards increases, the remaining space for housing connectors decreases. In this way, co...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067H01R13/631
CPCH01R13/6315H01R2103/00G01R1/06722H01R2201/20H01R13/2421H01R24/40G01R1/06772
Inventor 迪特尔·伯泽西格弗里多·休奇吉赛普·兰弗兰科尼马蒂亚·谢吉亚
Owner 泰科电子服务有限责任公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products