Semiconductor luminescent device

A technology of light-emitting devices and semiconductors, applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve problems affecting reliability, etc., and achieve the effect of preventing the deterioration of processability
CN1306626CInactive Publication Date: 2007-03-21SHARP KK
6 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHARP KK
Publication Date
2007-03-21
Estimated Expiration
Not applicable · inactive patent

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A semiconductor light emitting device includes an LED chip (4), a first lead frame (1) on which the LED chip (4) is mounted, a second lead frame (2) electrically connected to the LED chip (4) via a bonding wire (5), and a resin portion (3) surrounding the circumference of the LED chip (4), and fastening the first and second lead frames (1, 2). A metal body (8) is located under the region of the first lead frame (1) where the LED chip (4) is mounted.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a semiconductor light emitting device and a manufacturing method thereof, and more particularly, to a semiconductor light emitting device using a light emitting element such as a light emitting diode (LED) and a manufacturing method thereof. Background technique

[0002] FIG. 8 shows an example of a conventional semiconductor light emitting device.

[0003] Referring to FIG. 8 , the resin part 3 is formed by insert molding in such a way as to fasten the first lead frame 1 and the second lead frame 2 . The LED chip 4 is mounted on the first lead frame 1 with Ag paste 7 . Bonding wires 5 are connected to the second lead frame 2 . The LED chips 4 are surrounded by epoxy resin 6 to be protected and sealed.

[0004] Next, a method of manufacturing the semiconductor light emitting device shown in FIG. 8 will be described.

[0005] The first lead frame 1 and the second lead frame 2 are formed in a predetermined pattern con...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More