Radiating device of multi-chip combined LED (light emitting diode)

A technology of light-emitting diodes and heat dissipation devices, which is applied in cooling/heating devices of lighting devices, semiconductor devices of light-emitting elements, lighting devices, etc., and can solve problems such as reduced luminous efficiency, shortened service life, and heat dissipation hindering the development of high-brightness LEDs. , to improve heat dissipation efficiency and avoid insufficient heat dissipation

Inactive Publication Date: 2011-09-28
泰州赛龙电子有限公司
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0002] Due to the improvement of lighting brightness and other requirements, multi-chip combination LEDs and high-power LEDs have emerged as the times require. Higher power will inevitably lead to more heat, especially the cluster configuration of multi-chip combination LEDs. The heat is not eas

Method used

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  • Radiating device of multi-chip combined LED (light emitting diode)
  • Radiating device of multi-chip combined LED (light emitting diode)
  • Radiating device of multi-chip combined LED (light emitting diode)

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Example Embodiment

[0012] The present invention is further described with reference to the drawings and embodiments. A heat dissipation device for multi-chip combined LED light-emitting diodes. The multiple LED light-emitting chips 1 are distributed on a substrate 2, and the substrate 2 is opposite to the LED light-emitting chip 1. A T-shaped heat-conducting column 3 is connected to the other side. The T-shaped heat-conducting column 3 is a hollow and sealed structure. The cavity of the T-shaped heat-conducting column 3 is provided with a heat dissipation fluid 4, and the T-shaped heat-conducting column 3 is opposite to A heat sink 6 is connected to the vertical portion 5 of the substrate 2; the heat sink 6 includes a heat sink 7 and a fin 8, the heat sink 7 is a hollow cylindrical structure, and the T-shaped heat conducting column 3 is opposite to the substrate The vertical part 5 of 2 and the inner side wall of the heat sink 7 are respectively provided with thread and thread structures, and the ...

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Abstract

The invention discloses a radiating device of a multi-chip combined LED (light emitting diode). A plurality of LED light emitting chips are distributed on a substrate; the other side of the substrate opposite to the LED light emitting chips is connected with a T-shaped heat conducting column which is a hollow seal structure; a cavity of the T-shaped heat conducting column is internally provided with a radiating liquid. Through the heat conduction effect of intensifying the radiating device by the radiating liquid, the heat is absorbed by the radiating liquid from the light emitting diode, and is then conducted to a radiator by the T-shaped heat conduction column or in the air, the radiating efficiency is improved, and the problems that the light emitting efficiency is reduced and the service life is shortened caused by insufficient radiation for the multi-chip combined LED are avoided.

Description

Technical field: [0001] The invention relates to a heat dissipation device for LED light-emitting diodes, in particular to a heat dissipation device for multi-chip combined LED light-emitting diodes. Background technique: [0002] Due to the improvement of lighting brightness and other requirements, multi-chip combination LEDs and high-power LEDs have emerged as the times require. Higher power will inevitably lead to more heat, especially the cluster configuration of multi-chip combination LEDs. The heat is not easy to dissipate, but if the heat generated cannot be dissipated in time, it will lead to problems such as reduced luminous efficiency and shortened service life. cannot achieve comprehension. Therefore, the problem of heat dissipation has become a bottleneck hindering the development of high-brightness LEDs. Invention content: [0003] The invention overcomes the defects of the prior art and provides a heat dissipation device for multi-chip combined LED light-em...

Claims

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Application Information

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IPC IPC(8): F21Y101/02F21V29/00F21V29/56F21V29/74F21Y115/10
Inventor 吴加杰
Owner 泰州赛龙电子有限公司
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