Solid light-emitting element and light source module with same
A solid-state lighting and light source module technology, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., can solve the problems of mutual interference between current path and heat flow path, increase of thermal resistance of light-emitting diodes, poor overall heat dissipation performance of light-emitting diodes, etc.
Inactive Publication Date: 2013-09-11
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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Problems solved by technology
However, since the electrode conducts electricity and conducts heat, the current path and the heat flow path interfere with each other, which easily increases the thermal resistance of the light-emitting diode, so that the overall heat dissipation performance of the light-emitting diode is not good.
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[0045] figure 1 and figure 2 Shown is the light source module of the first embodiment of the present invention, the light source module includes a solid state light emitting element 10, a heat sink 20 thermally connected to the solid state light emitting element 10, and a solid state light emitting element 10 electrically connected circuit board 30 .
[0046] The solid-state light-emitting device 10 includes a substrate 11 , two conductive layers 12 , a heat-conducting block 13 , a solid-state light-emitting chip 14 and a light-transmitting protective layer 15 .
[0047] The base body 11 is columnar and has a first surface 111 , a second surface 112 opposite to the first surface 111 , and a side surface 113 connecting the first and second surfaces 111 , 112 . The substrate 11 defines a groove 114 on the first surface 111, the groove 114 is used to accommodate the solid-state light-emitting chip 14, the groove 114 is in the shape of a truncated cone, and its size gradually d...
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The invention relates to a solid light-emitting element which comprises a solid light-emitting chip, a base body, two conductive layers and a heat conduction block, wherein the base body is provided with a first surface, a second surface and a side surface, wherein the second surface is opposite to the first surface; the side surface is connected to the first surface and the second surface; the first surface of the base body is provided with a groove for receiving the solid light-emitting chip; the base body is provided with a through hole which is formed by the solid light-emitting chip extending from the second surface; the two conductive layers are isolated mutually, and each conductive layer comprises a first connecting end and a second connecting end, wherein the first connecting endis electrically connected with the solid light-emitting chip; the second connecting end extends to the side surface of the base body; and the heat conduction block is filled in the through hole and forms heat contact with the solid light-emitting chip, and the solid light-emitting chip is thermal electrically separated, and has better light-emitting characteristic and radiating efficiency. The invention also relates to a light source module with the solid light-emitting element.
Description
technical field [0001] The invention relates to a solid-state light-emitting element, in particular to a light source module with a solid-state light-emitting element. Background technique [0002] As an emerging light source, LED light source has many characteristics such as long working life, environmental protection, power saving, and long life. Moreover, the current modules composed of light-emitting diodes can produce high-power, high-brightness light sources, so they will widely and revolutionaryly replace conventional light sources such as traditional incandescent lamps, and then become the main light source that meets the theme of energy conservation and environmental protection. However, as the power and brightness of LEDs or their modules increase, the heat generated by them will also increase. If the heating problem of LEDs cannot be solved in time, the working life of LED lamps will be seriously affected. [0003] At present, the industry usually vertically arra...
Claims
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IPC IPC(8): H01L33/48H01L33/62H01L33/64
CPCH01L2224/48091
Inventor 赖志铭
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC