Magnetic field current sensors
A technology of current sensor and magnetic sensor, which is applied in the direction of only measuring current, electric solid device, voltage/current isolation, etc., and can solve the problems of unintegrated conductor 201, hysteresis overload capability, horizontal background field suppression limit, etc.
Inactive Publication Date: 2014-06-25
INFINEON TECH AG
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- Abstract
- Description
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- Application Information
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Problems solved by technology
System 200 is generally small and lightweight, but since conductor 201 is not integrated into package 208, it may suffer from assembly tolerance issues
The system 200 also suffers from limited bandwidth due to eddy currents in the leadframe of a standard IC package 208
Furthermore, although system 200 uses a differential measurement principle (i.e., system 200 measures magnetic fields at two different locations and subtracts them from each other), suppression of horizontal background fields perpendicular to current traces is limited
The system 200 also requires specific technical processes to manufacture the concentrator 204, which itself may introduce additional errors, such as hysteresis and limited overload capability
Method used
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Embodiment Construction
[0038] The invention relates to a low-cost integrated current sensor. In an embodiment, the stacked metal sheet layers form the current sensor conductors. In one embodiment, the first metal sheet layer is relatively thicker than the second metal sheet layer stacked thereon.
[0039] In one embodiment, a sheet metal element is coupled to at least a portion of the top surface of the sensor die. The sheet metal element forms the conductor for the current measured via the associated magnetic field by a magnetic field sensor on the sensor die, such as a Hall element, and in one embodiment, there is no conductive connection between the sensor die and the conductor . In various embodiments, it may be advantageous to also use the sheet metal as the leadframe portion of the pins of the sensor die. In various embodiments, electrical contact between the sensor die and pins may be established via through-wafer contacts, common bonding circuits, or flip-chip assembly of the die. In var...
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Current sensors, conductors and methods are disclosed. In an embodiment, a magnetic current sensor comprises a conductor comprising a first sheet metal layer having a first thickness and comprising at least one hole, and a second sheet metal layer having a second thickness less than the first thickness and comprising at least one notch, the second sheet metal layer being coupled to the first sheet metal layer such that the at least one hole of the first sheet metal layer at least partially overlaps with the at least one notch of the second sheet metal layer; and an integrated circuit (IC) die comprising at least one magnetic sensor element and being coupled to the conductor such that the at least one magnetic sensor element is generally aligned with a tip of the at least one notch of the second sheet metal layer.
Description
[0001] related application [0002] This application is related to U.S. Patent Application Serial No. 12 / 630,596, filed December 3, 2009, entitled "MAGNETIC FIELD CURRENT SENSORS," which claims the Priority, the entire contents of these two patent documents are hereby incorporated by reference. technical field [0003] The present invention relates generally to current sensors, and more particularly, to relatively low cost integrated current sensors that sense current via an associated magnetic field. Background technique [0004] Sensor modules with large magnetic cores are typically costly and bulky. figure 1 An example of such a system 100 is shown in . exist figure 1 , the primary conductor 102 passes through a slit magnetic core 104 which collects all flux around the conductor 102 and directs it to a Hall sensor 106 placed in an air gap 108 of the core 104 . System 100 and other similar systems are not differential, which means that these systems typically measure t...
Claims
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IPC IPC(8): G01R19/00G01R15/20H10N52/80
CPCG01R33/072G01R15/202G01R33/07G01R19/0092H01L43/04G01R15/207H01L2224/48091H01L2224/49175H01L2224/48247H01L2924/00014H10N52/80
Inventor U.奥泽勒赫纳
Owner INFINEON TECH AG