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Packaging material

A packaging material and photoluminescence technology, applied in photovoltaic power generation, electrical components, circuits, etc., can solve the problems of complex manufacturing process, increased manufacturing process and related costs, and inability to improve the heat resistance of inner layer packaging materials.

Active Publication Date: 2013-03-13
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above method cannot improve the heat resistance of the inner packaging material, and the manufacturing process is complicated
On the other hand, the outermost fluorescent dye layer may require additional packaging material protection, which will increase the process and related costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030]Get 80, 90, 98, and 99 weight percent (wt%) of ethylene-vinyl acetate copolymer (DupontD150, VA content: 32%) and 20, 10, 2, and 1 weight percent (wt%) of poly Caprolactone (source as shown in Preparation Example 1B) was mixed with toluene (Tedia, 99%) as a solvent, and then made into a film on glass by spin coating (Spin coating), and its haze and transmittance were measured respectively As shown in Table 1. It can be seen from Table 1 that even if the amount of polycaprolactone is increased to 10wt%, the film still has high transmittance and low haze, indicating that polycaprolactone can be effectively dispersed in ethylene-vinyl acetate copolymer.

[0031] Table 1

[0032]

preparation example 1A

[0039] Get 0.09g of 1-pyrene butanol (1-pyrenebutanol, Aldrich), 18g of caprolactone (Tokyo Chemical TCI purity 98%) and 0.1g of stannous octoate (Aldrich) dissolved in 20mL toluene (Tedia, 99% ), heated to 130°C for ring-opening polymerization for 8 hours as shown in Formula 2, 7g of photoluminescent polymers (yield 70%) were formed, the number average molecular weight was 8139 as measured by GPC, and its melting point was between 55°C Its refractive index is between 1.52 and 1.48, and its film absorption spectrum and the fluorescence emission spectrum obtained by using the central wavelength of 340nm as the excitation light source are as follows: figure 2 shown.

[0040]

preparation example 1B

[0042] Get 18g of caprolactone (TCI) and 0.1g of stannous octoate (Aldrich) and be dissolved in 20mL toluene, be heated to 130 ℃ and carry out ring-opening polymerization reaction and promptly form 15g polycaprolactone polymer (productive rate 83% ), its number average molecular weight measured by GPC is 8500, and its melting point is between 55°C and 60°C.

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Abstract

The invention provides a packaging material, which comprises 80-99.5 percent by weight (wt%) of ethylene-vinyl acetate copolymer and 0.5-20 percent by weight (wt%) of photoluminescent high molecules, wherein the ethylene-vinyl acetate copolymer and the photoluminescent high molecules are uniformly mixed. The packaging material can be applied to packaging of a solar cell; the damage to the ethylene-vinyl acetate copolymer by ultraviolet ray is reduced; and the light utilization rate of the solar cell can also be improved.

Description

technical field [0001] The invention relates to an encapsulation material, in particular to the application of the encapsulation material in a solar cell encapsulation module. Background technique [0002] The first solar cell was manufactured by Bell Labs in the United States in 1954 to provide power for communication systems in remote areas. However, its efficiency is too low (only 6%) and the cost is too high ($357 / W), so it lacks commercial value. In order to overcome the shortcomings of low efficiency, high cost, and short service life, many researchers have proposed many solutions over the years, but most of them cannot completely solve the related problems. [0003] In order to block the influence of air and water vapor on the solar cell, reduce environmental damage to the chip, and increase its industrial applicability, an encapsulation module can be used. The above-mentioned packaging module must have good UV resistance, thermal cracking resistance, and fast curin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/08C08L67/04H01L31/048
CPCY02E10/50
Inventor 关旻宗李明家王文献邱国展李宗铭叶芳耀
Owner IND TECH RES INST