High temperature resistant antistatic coating and preparation method thereof
An anti-static and coating technology, applied in coatings, conductive coatings, etc., can solve the problems of difficult high temperature resistance, poor environmental resistance of anti-static coatings, and poor surface adhesion of quartz ceramic radomes, and achieve high adhesion. , The effect of easy adjustment of resistivity and less amount of raw materials
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Embodiment 1
[0021] A high temperature resistant antistatic coating of the present invention, the antistatic coating is based on a two-component modified silicone resin, with ATO semiconductor powder as a conductive filler, two-component modified silicone resin and ATO semiconductor The mass ratio of the powder is 3:2; in this embodiment, the two-component modified silicone resin is made of TR613 heat-resistant topcoat with a solid content of 75% and a mass ratio of 5:1 (Jiangyin City Osaka Paint Co., Ltd.) and curing agent (the curing agent corresponding to TR613 heat-resistant topcoat produced by Jiangyin Osaka Paint Co., Ltd.).
[0022] The preparation method of the above-mentioned antistatic coating comprises the following process steps:
[0023] (1) Ball milling: Weigh 3:2 two-component modified silicone resin (TR613 heat-resistant topcoat and corresponding curing agent with a solid content of 75% and a mass ratio of 5:1) and ATO semiconductor powder Mix the two into a slurry, then u...
Embodiment 2
[0029] A high temperature resistant antistatic coating of the present invention, the antistatic coating is based on a two-component modified silicone resin, with ITO semiconductor powder as a conductive filler, two-component modified silicone resin and ITO semiconductor The mass ratio of the powder is 7:3; in this embodiment, the two-component modified silicone resin is made of TR613 heat-resistant topcoat (Jiangyin City Osaka Coatings) with a solid content of 75% and a mass ratio of 5:1. Ltd.) and R30 curing agent.
[0030] The preparation method of the above-mentioned antistatic coating is: first weigh the two-component modified silicone resin with a mass ratio of 7:3 (TR613 heat-resistant topcoat with a solid content of 75% and a mass ratio of 5:1 and R30 curing agent) and ITO semiconductor powder, and then perform ball milling, spraying, curing and heat treatment according to the same preparation process steps and process parameters as in Example 1, to obtain the high temp...
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Abstract
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