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Integrated circuit device and manufacturing method thereof

A technology of integrated circuits and material layers, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve problems such as inability to fully meet, and achieve the effects of improving quality, increasing uniformity, reducing load and dishing effect

Active Publication Date: 2015-12-16
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the existing alignment structures and methods are generally suitable for their intended purposes, they cannot fully meet the needs of all aspects

Method used

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  • Integrated circuit device and manufacturing method thereof
  • Integrated circuit device and manufacturing method thereof
  • Integrated circuit device and manufacturing method thereof

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Embodiment Construction

[0050] It can be understood that the present invention provides many different embodiments or examples below to implement different features of the present invention. Specific components and configuration examples are described below to simplify the present invention. Of course, these are just examples and not intended to limit the present invention. In addition, for the sake of simplicity and clarity, reference numbers and / or symbols are repeated in various embodiments of the present invention, but the repetition itself does not necessarily require any relationship between the various embodiments and / or configurations discussed. Moreover, the first feature described in the following description is formed on the second feature, or the first feature is formed on the second feature, may include the embodiment that the first feature and the second feature form direct contact, and may also include Additional features are formed between the first and second features such that the ...

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Abstract

The invention provides an integrated circuit device and a manufacturing method thereof. An exemplary device includes a substrate having an alignment region, an alignment feature located in the alignment region of the substrate, and a dummy feature disposed within the alignment feature. A dimension of the dummy feature is smaller than the resolution of the alignment mark detector.

Description

technical field [0001] The present invention generally relates to an integrated circuit (Integrated Circuit; IC) device, and more particularly relates to an alignment design structure and method for manufacturing an IC device. Background technique [0002] The semiconductor IC industry has gone through a stage of rapid growth. Technological developments in IC materials and design have produced multiple IC generations, where each generation has smaller and more complex circuits than the previous generation. These IC devices are fabricated by patterning a series of patterned and unpatterned layers, and the features on the successive patterned layers are spatially related to each other. During the manufacturing process, each patterned layer must be aligned with the previous patterned layer with a certain degree of precision. Pattern alignment technology usually provides an overlay mark to achieve alignment of continuous layers. An exemplary overlay marking is a pattern regis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/544H01L21/70
CPCG03F7/70633G03F7/70683H01L23/544H01L2223/54426H01L2223/54453H01L2924/0002H01L21/28H01L2924/00
Inventor 姚欣洁王宪程黄建凯陈俊光
Owner TAIWAN SEMICON MFG CO LTD