Device for preparing thin-strip resilience body and application thereof

A technology for preparing devices and projectiles, which is applied in the field of testing, can solve the problems that manufacturers and users have no way to test, and achieve the effect of fast measurement work, easy mastery, and simple measurement technology

Active Publication Date: 2013-06-05
KUNMING XIALANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But how to identify the soft and hard of the interconnection belt? General manufacturers and users have no way to detect

Method used

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  • Device for preparing thin-strip resilience body and application thereof
  • Device for preparing thin-strip resilience body and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Such as figure 1 , 2 As shown, 1 in the figure is an integral female mold, 2 is a tinned copper strip with a specification of 0.2×1.6mm, the copper substrate is T1Cu, 99.95% pure, and the thickness is 0.153mm. Both surfaces of the thin strip are plated with Sn alloy solder. After being cut into 50mm lengths, put it into the upper groove of the female mold 1, and push the left end to the step. 3 is punch, and 4 is elastic sheet, selects the thick vacuum rubber of 5mm for use, wide 15mm, glues on the cavity wall of female mold with glue, and the thickness of B is 8mm. B' is also 8mm wide, with an interference of 0.306mm, and H is 68mm; 5 is the supporting plate, which is located at the lower end of the female mold.

[0016] Use a punch press to press down the punch and move in the direction of the P arrow at a speed of 16mm / min. The α angle of the punched formed part to be tested is 15o. 30 pieces were punched under the same conditions, and the measured α angles were a...

Embodiment 2

[0018] The situation is basically the same as in Example 1, except that the copper substrate is annealed more fully, and the punch is pressed manually. Other conditions remain unchanged, the measured rebound angle α is 10o.

Embodiment 3

[0020] The situation is basically the same as that of Example 1, except that the grade of the copper substrate is T2 (999% purity), the annealing conditions of copper are the same as T1, and other conditions are also the same as Example 1. 20o.

[0021] Two conclusions are illustrated through the above examples: one is that as the purity of the copper substrate increases, the α angle will become smaller under the same annealing conditions; the other is that the purity of the copper substrate can be changed from 99.95% to 99.99%. It is reflected in the value of α.

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PUM

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Abstract

The invention relates to hardness testing technologies and devices. In the prior art, the measurement on material hardiness is implemented mainly by using a hardness tester, the technology is complex, and the hardness tester is expensive in price. The device provided by the invention has a cavity die, wherein the upper end of the cavity die is provided with a groove, a measured strip is arranged in the groove, an elastic sheet is fixed on the internal cavity wall of the cavity die, and the lower end of the cavity die is provided with a supporting board for fixing the cavity die and the elastic sheet; and a punch is hung above the cavity die, and the punch has such a length that the measured strip can be punched out of the cavity die. The device provided by the invention can be used for measuring the hardness of materials; and the device is simple to operate and low in equipment cost.

Description

technical field [0001] The invention relates to the technical field of testing, in particular to hardness testing technology and equipment. Background technique [0002] In the prior art, hardness testers are mainly used to measure the hardness of materials, including Brinell hardness testers and Vickers hardness testers. Measuring the hardness of materials with a hardness tester is complex and expensive. [0003] In addition, for the interconnection strips used in photovoltaic panels (interconnection strips in tin-coated copper strips), the surface of the copper strips is very soft when tin alloy is coated, so there is no need to measure the softness and hardness, but the hardness of the core copper must be measured. The tin alloy coating had to be removed first, a laborious and time-consuming process that also required chemical expertise. Due to the high hardness of the interconnection strip, the fragmentation rate of the silicon cell is large during welding, so manufact...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N3/62G01N3/40
Inventor 刘雅洲李志平刘璐刘颖绚刘艳绚
Owner KUNMING XIALANG TECH CO LTD
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